10AX090S3F45I2SG

IC FPGA 624 I/O 1932FCBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 624 59234304 900000 1932-BBGA, FCBGA

Quantity 1,406 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FCBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O624Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs339620Number of Logic Elements/Cells900000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits59234304

Overview of 10AX090S3F45I2SG – Arria 10 GX Field Programmable Gate Array (FPGA) IC

The 10AX090S3F45I2SG is an Intel Arria 10 GX field programmable gate array device in a 1932-FCBGA (45×45) package. As part of the Arria 10 family of 20 nm mid-range FPGAs and SoCs, it delivers a combination of high logic capacity, embedded memory, and I/O density intended for performance- and power-sensitive midrange applications.

This device targets communications, broadcast, computing, medical, and defense markets where large logic resources, significant on-chip RAM, and flexible I/O are required. Its value proposition centers on substantial programmable capacity and system-level features provided in an industrial-grade, surface-mount package.

Key Features

  • Logic Capacity — 900,000 logic elements to implement complex custom logic, protocol engines, and acceleration functions.
  • Embedded Memory — 59,234,304 total RAM bits for large on-chip buffers, caches, and packet or image processing storage.
  • I/O Density — 624 user I/O pins to support wide parallel interfaces and multiple high-speed external connections.
  • Core Architecture — Part of the Arria 10 20 nm family, delivering the series’ performance and power-efficiency characteristics.
  • DSP and Timing Resources — Includes variable-precision DSP block concepts and advanced clock networks with PLL clock sources to support signal processing and timing-critical designs.
  • High-speed Interfaces — Series-level support for PCIe Gen1/Gen2/Gen3 hard IP and enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet as part of Arria 10 device capabilities.
  • Configuration and Reconfiguration — Supports dynamic and partial reconfiguration methods described for Arria 10 devices to enable flexible in-field updates.
  • Package & Mounting — 1932-BBGA (1932-FCBGA, 45×45) surface-mount package suited for dense system boards.
  • Power — Operating core voltage range of 870 mV to 930 mV for power domain planning and system supply design.
  • Industrial Temperature Grade — Qualified for −40 °C to 100 °C operating temperature range for demanding environments.
  • Regulatory — RoHS compliant.

Typical Applications

  • Wireless Infrastructure — Implement channel processing, baseband functions, and remote radio head interfaces where large logic and memory resources are needed.
  • Wireline and Networking — Support 40G/100G line cards, transponders, and bridging/aggregation functions using high I/O count and series-level high-speed interface IP.
  • Computing & Storage Acceleration — Build flash cache controllers, server acceleration modules, and cloud offload engines leveraging large programmable logic and on-chip RAM.
  • Broadcast and Professional Video — Implement video processing, muxponders, and studio switching with abundant logic and memory for buffering and real-time processing.
  • Medical & Defense Systems — Use in diagnostic imaging, radar, and signal-processing subsystems where industrial temperature range and high integration are required.

Unique Advantages

  • Substantial Programmable Capacity: 900,000 logic elements enable large, complex designs without immediate need to partition across multiple devices.
  • Large On-Chip Memory: 59,234,304 bits of RAM provide ample space for packet buffers, image frames, or intermediate data storage to reduce external memory dependency.
  • High I/O Count: 624 I/Os allow flexible connectivity to multiple peripherals, PHYs, and external memory interfaces.
  • Industrial-Grade Thermal Range: Rated for −40 °C to 100 °C operation to support deployed systems in challenging environments.
  • System-Level Interface Support: Arria 10 family features include PCIe Gen1/2/3 hard IP and enhanced PCS IP for high-speed serial links, aiding integration of common networking and storage protocols.
  • Compact, High-Density Package: 1932-FCBGA (45×45) surface-mount package balances pin count and board footprint for dense system designs.

Why Choose 10AX090S3F45I2SG?

The 10AX090S3F45I2SG positions itself as a high-capacity Arria 10 GX solution for midrange systems that demand large programmable logic, significant on-chip memory, and substantial I/O. Its combination of 900,000 logic elements, over 59 million bits of RAM, and 624 I/Os makes it suitable for complex signal processing, networking, and acceleration tasks within the Arria 10 portfolio.

Backed by the Arria 10 device architecture and Intel ecosystem development resources, this device supports a development flow and system integration path for teams focused on scalability, robustness, and long-term maintainability in industrial environments.

Request a quote or submit an inquiry to get pricing and availability information for the 10AX090S3F45I2SG FPGA.

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