10AX090S2F45I2SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 624 59234304 900000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 361 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FCBGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 624 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 339620 | Number of Logic Elements/Cells | 900000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 59234304 |
Overview of 10AX090S2F45I2SG – Arria 10 GX FPGA, 900,000 logic elements, 624 I/O
The 10AX090S2F45I2SG is an Intel Arria 10 GX field-programmable gate array (FPGA) supplied in a 1932-FCBGA (45×45) package for surface-mount assembly. This mid-range, 20 nm device targets high-performance, power-sensitive applications across wireless, wireline, broadcast, computing, medical and defense markets by combining large logic capacity and abundant on-chip memory with a wide operating temperature range.
Key Features
- Logic Capacity — 900,000 logic elements provide substantial programmable fabric for complex digital designs and system-level integration.
- On-chip Memory — 59,234,304 total RAM bits enable extensive buffering, packet processing and algorithm acceleration without immediate external memory dependency.
- I/O Density — 624 I/O pins support rich external interfacing for high-channel count systems and multi-protocol connectivity.
- Power Supply Range — Core voltage operation specified from 870 mV to 980 mV to support regulated power domains and efficient power delivery.
- Package & Mounting — 1932-BBGA / 1932-FCBGA (45×45) package for surface-mount PCB assembly, delivering high pin count in a compact footprint.
- Thermal & Grade — Industrial grade device rated for operation from −40 °C to 100 °C for deployment in temperature-demanding environments.
- Standards Compliance — RoHS compliant.
- Arria 10 Family Capabilities — Part of the Intel Arria 10 device family, designed for mid-range applications that require performance and power efficiency on a 20 nm process.
Typical Applications
- Wireless Infrastructure — Channel processing and switch cards in remote radio heads and mobile backhaul equipment where logic density and on-chip memory reduce external component needs.
- High-speed Wireline — Line cards, muxponders and transponders that require substantial I/O and on-chip RAM for packet buffering and protocol handling.
- Broadcast & Professional AV — Studio switching, video transport and conferencing systems that benefit from large programmable fabric and deterministic processing.
- Computing & Storage Acceleration — Server offload and flash cache controllers leveraging high logic capacity to implement custom acceleration engines.
- Medical & Industrial Systems — Diagnostic imaging and control systems operating across wide temperature ranges and requiring robust programmable logic.
Unique Advantages
- High logic density: 900,000 logic elements enable consolidation of multiple functions into a single device, reducing PCB complexity and BOM count.
- Large embedded memory: 59,234,304 total RAM bits support deep buffering and algorithm state retention on-chip, improving latency and throughput.
- Extensive I/O connectivity: 624 I/O pins allow flexible interfacing with high-channel-count peripherals and external systems without immediate need for I/O expanders.
- Industrial temperature rating: −40 °C to 100 °C operational range supports deployment in demanding environmental conditions.
- Compact, high-pin-count package: The 1932-FCBGA (45×45) delivers a dense pinout suitable for complex board layouts while maintaining a manageable footprint.
- RoHS compliance: Simplifies design-in for markets requiring lead-free and environmentally compliant components.
Why Choose 10AX090S2F45I2SG?
The 10AX090S2F45I2SG positions itself as a high-capacity, power-aware Arria 10 GX FPGA suitable for mid-range applications that demand significant programmable logic, substantial on-chip RAM and broad I/O connectivity. Its industrial temperature rating and RoHS compliance make it appropriate for systems requiring both performance and environmental robustness.
Designers targeting wireless infrastructure, wireline transport, broadcast, computing acceleration or advanced industrial systems will find the device’s combination of logic density, memory and package pin-count valuable for consolidating functions, shortening development cycles and scaling system capabilities within a single FPGA platform.
Request a quote or submit an RFQ to check availability and lead times for the 10AX090S2F45I2SG and see how it fits your next design.

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