10AX090S2F45I2LG

IC FPGA 624 I/O 1932FCBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 624 59234304 900000 1932-BBGA, FCBGA

Quantity 475 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FCBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O624Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs339620Number of Logic Elements/Cells900000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits59234304

Overview of 10AX090S2F45I2LG – Arria 10 GX FPGA, 900,000 Logic Elements, 1932-FCBGA

The 10AX090S2F45I2LG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 1932-ball FCBGA package. It is a 20 nm mid-range, high-performance FPGA offering large logic capacity and on‑chip memory targeted at demanding communications, compute and industrial applications.

With 900,000 logic elements and over 59 million bits of embedded RAM, this device is designed for applications that require high I/O density, significant on‑chip memory bandwidth, and operation across an industrial temperature range.

Key Features

  • Logic Capacity  900,000 logic elements provide substantial programmable fabric for complex logic, control and signal-processing tasks.
  • Embedded Memory  59,234,304 total RAM bits enable large on‑chip storage for buffering, packet processing, and lookup tables.
  • I/O Density  624 user I/O pins support high‑density external interfacing for multi‑lane links, memory interfaces, and board-level connectivity.
  • Transceiver and Series Architecture (Arria 10 GX)  Part of the Arria 10 GX family, offering device-level features and architecture for mid-range FPGA applications described in the device overview.
  • Power Supply Range  Core voltage operation between 870 mV and 980 mV for defined power delivery and regulator selection.
  • Industrial Temperature Rating  Qualified for operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
  • Package & Mounting  1932-ball FCBGA (1932‑BBGA) package, supplier device package 1932-FCBGA (45×45), surface-mount for compact board-level integration.
  • Regulatory  RoHS compliant.

Typical Applications

  • Wireless Infrastructure  Channel cards and switch interfaces in remote radio heads and mobile backhaul systems requiring programmable logic and dense I/O.
  • Wireline Networking  Line cards, muxponders and transponders for 40G/100G systems where on‑chip memory and logic capacity support packet handling and protocol processing.
  • Broadcast & Professional AV  Studio switching and transport functions that benefit from high I/O counts and large embedded RAM for frame buffering and format conversion.
  • Compute & Storage Acceleration  Flash cache, server acceleration, and cloud infrastructure offload that leverage programmable logic and significant on‑chip memory.
  • Medical & Defense Systems  Diagnostic imaging, radar and secure communications applications that require industrial temperature operation and high integration.

Unique Advantages

  • High Logic Density:  900,000 logic elements enable consolidation of complex algorithms and multiple functions onto a single device, reducing board BOM and latency between blocks.
  • Large On‑Chip RAM:  Over 59 million bits of embedded RAM provide local storage for buffering and state machines, minimizing external memory dependence.
  • Extensive I/O:  624 I/Os give flexible connectivity options for multi‑lane interfaces, peripherals and memory buses without external multiplexing.
  • Industrial Reliability:  Rated for −40 °C to 100 °C operation to support deployments in thermally demanding environments.
  • Compact, High‑Pin Package:  1932‑ball FCBGA (45×45) delivers high I/O and signal routing density in a surface‑mount form factor suited to space-constrained boards.
  • Standards‑oriented Family Features:  As part of the Arria 10 GX family, the device aligns with documented family-level features and design guidance from the device overview.

Why Choose 10AX090S2F45I2LG?

The 10AX090S2F45I2LG combines large programmable logic capacity, substantial embedded RAM, and high I/O density in a single industrial‑rated FCBGA package. It fits designs that need to integrate complex processing, buffering and dense interfacing while maintaining predictable thermal and power constraints defined by the device supply and operating range.

This device is well suited for system designers and procurement teams targeting mid‑range FPGA performance with a focus on scalability, on‑chip memory resources, and a compact board footprint provided by the 1932‑ball FCBGA package.

Request a quote or submit an inquiry for 10AX090S2F45I2LG to begin evaluating this Arria 10 GX FPGA for your next design.

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