10AX090S3F45E2SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 624 59234304 900000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 1,020 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FCBGA (45x45) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 624 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 339620 | Number of Logic Elements/Cells | 900000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 59234304 |
Overview of 10AX090S3F45E2SG – Arria 10 GX Field Programmable Gate Array (FPGA) IC
The 10AX090S3F45E2SG is an Intel Arria 10 GX FPGA in a 1932‑FCBGA package designed for high‑performance, power‑efficient midrange FPGA applications. This device combines a large programmable logic fabric with abundant embedded memory and high I/O density to support demanding communications, compute, and signal‑processing designs.
Key attributes include 900,000 logic elements, 59,234,304 total RAM bits, 624 user I/O signals, and operation over an extended temperature range, making it well suited for systems requiring significant on‑chip logic, memory bandwidth, and I/O connectivity.
Key Features
- Large Logic Capacity Provides 900,000 logic elements to implement complex finite state machines, custom accelerators, and high‑density glue logic.
- Embedded Memory 59,234,304 total RAM bits of on‑device memory for buffering, packet processing, and temporary storage of data streams.
- High I/O Density 624 general‑purpose I/O pins support broad interface options and dense board routing for multi‑lane interfaces and parallel buses.
- Advanced Packaging Supplied in a 1932‑FCBGA (45×45 mm) package for compact, high‑pin‑count surface‑mount integration.
- Low‑Voltage Core Core supply range of 870 mV to 930 mV to match modern power‑rail architectures and optimize power consumption.
- Extended Temperature Grade Rated for operation from 0 °C to 100 °C, suitable for thermally demanding commercial and industrial environments.
- Arria 10 Family Features As part of the Arria 10 family, the device benefits from architecture features such as variable‑precision DSP blocks, embedded memory blocks, PLL clock resources, and hard IP for high‑speed interfaces as described in the Arria 10 device documentation.
- Manufacturer and Compliance Manufactured by Intel and RoHS compliant.
Typical Applications
- Wireless Infrastructure Channel cards, switch interfaces and backhaul equipment leveraging the device's high logic and memory capacity for signal processing and protocol handling.
- High‑Speed Wireline Line cards, muxponders, and transponder modules where dense I/O and on‑chip memory support multi‑lane data aggregation and buffering.
- Compute and Acceleration Server acceleration and flash‑cache controllers that use large logic and memory resources for custom data‑path acceleration and low‑latency buffering.
- Broadcast and Professional AV Studio switching and transport equipment requiring flexible logic for frame processing, routing, and media bridging.
Unique Advantages
- Scalable FPGA Logic: 900,000 logic elements enable implementation of complex, multi‑module designs on a single device, reducing board count and system complexity.
- Substantial On‑Chip Memory: Nearly 59.3 million RAM bits provide ample buffering and scratchpad memory for packet processing, video frames, and DSP pipelines.
- High Pin Count in a Compact Package: 624 I/Os in a 1932‑FCBGA (45×45) footprint deliver high connectivity without excessive PCB area.
- Power‑Sensitive Core Voltage: The 870–930 mV supply range aligns with modern low‑voltage power domains to help control system power dissipation.
- Extended‑Grade Operation: Rated 0 °C to 100 °C to support a wide range of commercial and industrial application environments.
- Verified Family-Level Capabilities: Leverages Arria 10 family features—such as DSP blocks, PLLs, embedded memory types, and high‑speed interface IP—documented in the Arria 10 device overview.
Why Choose 10AX090S3F45E2SG?
The 10AX090S3F45E2SG positions itself as a high‑capacity, versatile FPGA for midrange systems that require significant programmable logic, large embedded memory, and high I/O counts. Its Arria 10 GX heritage brings architectural features for DSP, memory, and high‑speed interfaces while the extended temperature rating and surface‑mount FCBGA packaging ease integration into compact, robust designs.
Designers targeting communications, compute acceleration, broadcast, and advanced signal‑processing applications will find the device suitable for consolidating functionality, reducing BOM, and scaling complex algorithms on a single programmable platform backed by Intel's Arria 10 device documentation.
Request a quote or submit an inquiry to check availability and pricing for the 10AX090S3F45E2SG and start planning your design integration.

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