10AX090S4F45I3SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 624 59234304 900000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 577 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FCBGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 624 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 339620 | Number of Logic Elements/Cells | 900000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 59234304 |
Overview of 10AX090S4F45I3SG – Arria 10 GX FPGA, 900000 Logic Elements, 1932‑FCBGA
The 10AX090S4F45I3SG is an Intel Arria 10 GX field‑programmable gate array (FPGA) in a high‑density 1932‑FCBGA (45x45) surface‑mount package. It combines a large programmable fabric with substantial embedded memory and broad I/O to address mid‑range, performance‑sensitive applications.
Designed for markets such as wireless infrastructure, wireline and networking, broadcast, computing and storage, and industrial systems, this device delivers high logic density and power‑efficient operation while supporting advanced FPGA features called out in the Arria 10 device family.
Key Features
- Programmable Fabric 900,000 logic elements provide extensive capacity for complex digital designs and system acceleration.
- Embedded Memory 59,234,304 total RAM bits of on‑chip memory enable large buffers, caches, and data paths without external memory for many use cases.
- I/O and Transceivers 624 I/O pins support broad external connectivity; the Arria 10 family also includes low‑power serial transceiver features as part of the device architecture.
- Power and Supply Operates from a core supply range of 870 mV to 930 mV, allowing designers to target low‑voltage power domains.
- Package and Mounting Supplied in a 1932‑FCBGA (45x45) package with surface‑mount mounting for high‑density PCB implementations.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C and listed as Industrial grade for deployment in temperature‑challenging environments.
- Platform Capabilities (Arria 10 family) Device family features described in the Arria 10 documentation include power management, fractional PLLs, dynamic and partial reconfiguration, and hard IP blocks for common interfaces and protocols.
- RoHS Compliance Device is RoHS compliant for environmental and regulatory considerations.
Typical Applications
- Wireless Infrastructure Channel and switch cards or remote radio head modules that require high logic density and on‑chip memory to implement DSP, packet handling, and control logic.
- Wireline Networking 40G/100G line cards, muxponders and transponders that benefit from large programmable fabric, many I/Os, and embedded transceiver capabilities.
- Broadcast and Media Studio switches, video processing and transport systems that need high‑capacity logic and on‑chip memory for frame buffering and format conversion.
- Computing and Storage Acceleration Server acceleration, flash cache controllers, and cloud compute offload tasks that leverage large logic resources and embedded RAM to implement custom datapaths.
- Industrial Systems and Instrumentation Control, signal processing, and high‑speed data acquisition where industrial temperature range and a high pin count are required.
Unique Advantages
- High Logic Density: 900,000 logic elements allow consolidation of multiple functions into a single FPGA, reducing board‑level complexity.
- Substantial On‑Chip Memory: 59,234,304 total RAM bits support large buffers and local data storage, minimizing reliance on external memory interfaces.
- Extensive I/O Resources: 624 I/O pins provide flexibility to interface with a wide range of peripherals and high‑speed links.
- Industrial Temperature Rating: −40 °C to 100 °C operating range and industrial grade designation enable deployment in demanding environments.
- Compact, High‑Density Package: 1932‑FCBGA (45x45) packaging delivers a small footprint for high‑capacity designs where PCB area is constrained.
- Power‑Aware Design: Core supply range of 870 mV to 930 mV aligns with low‑voltage system designs and the Arria 10 family’s power‑saving features.
Why Choose 10AX090S4F45I3SG?
The 10AX090S4F45I3SG brings together large programmable capacity, significant embedded memory, and broad I/O in an industrial‑rated Arria 10 GX device. It is suited for engineers building mid‑range, performance‑sensitive systems that require on‑chip resources for signal processing, networking, or compute acceleration while maintaining a compact board footprint.
Choosing this FPGA offers design teams a balance of integration, flexibility, and environmental robustness, with Arria 10 platform capabilities that support advanced power management, reconfiguration, and interface IP referenced in the device family documentation.
Request a quote or submit an inquiry to our sales team to discuss availability, lead times, and volume pricing for 10AX090S4F45I3SG.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018