10AX090U2F45E2LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 480 59234304 900000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 1,381 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FCBGA (45x45) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 480 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 339620 | Number of Logic Elements/Cells | 900000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 59234304 |
Overview of 10AX090U2F45E2LG – Arria 10 GX FPGA, 900,000 Logic Elements, 1932‑FCBGA
The 10AX090U2F45E2LG is an Intel Arria 10 GX field‑programmable gate array (FPGA) in a 1932‑FBGA (1932‑FCBGA) package. It delivers a high logic capacity device architecture targeted at mid‑range, high‑performance applications where density, on‑chip memory and flexible I/O are critical.
Typical markets called out for the Arria 10 family include wireless and wireline communications, broadcast, computing and storage, medical imaging and defense systems. The device combines high logic count, extensive embedded memory and a range of system and configuration features to support those applications.
Key Features
- High Logic Capacity — 900,000 logic elements to implement complex digital functions and high‑density designs.
- Large Embedded Memory — 59,234,304 total RAM bits of on‑chip memory to support buffering, caching and large data structures on‑die.
- Rich I/O — 480 I/O pins for flexible external interfacing and system integration.
- Advanced Device Family Features — Series‑level capabilities include support for embedded memory blocks, variable‑precision DSP blocks, clock networks with PLL sources, dynamic and partial reconfiguration, and hard IP for high‑speed protocols as described in the Arria 10 overview.
- Transceiver and Protocol Support — Series documentation references low‑power serial transceivers and hard IP for PCIe and high‑speed Ethernet protocols for system connectivity (refer to Arria 10 family documentation for details).
- Power Supply Range — Core supply specified from 870 mV to 980 mV for device operation.
- Package & Mounting — 1932‑FCBGA package (supplier device package: 1932‑FCBGA (45×45)) with surface‑mount mounting type for compact board integration.
- Grade and Temperature — Extended grade device rated for operation from 0 °C to 100 °C.
- Regulatory — RoHS compliant.
Typical Applications
- Wireless Infrastructure — Channel and switch cards, and mobile backhaul hardware that require high logic density and on‑chip memory for real‑time signal processing.
- Wireline Networking — 40G/100G muxponders, transponders, and line cards that leverage large memory and extensive I/O for packet buffering and aggregation.
- Broadcast and Media — Studio switches, video transport and professional audio/video equipment benefiting from flexible I/O and high‑performance logic resources.
- Computing & Storage — Server acceleration, flash cache and cloud compute servers that use FPGA logic and memory for offload and low‑latency processing.
- Medical & Industrial Imaging — Diagnostic scanners and imaging systems requiring on‑device memory and DSP resources for image processing pipelines.
Unique Advantages
- High Logic Density: 900,000 logic elements enable implementation of complex algorithms and large control/data paths on a single device, reducing board count.
- Substantial On‑Chip Memory: Nearly 59.3 million RAM bits provide ample embedded storage for buffering, frame storage, and table lookups without external memory.
- Flexible System I/O: 480 I/Os and series transceiver/support features facilitate broad interfacing options for multi‑lane and multi‑protocol designs.
- Compact Surface‑Mount Package: 1932‑FCBGA (45×45) allows dense PCB layouts while maintaining high pin count for complex systems.
- Operational Range & Compliance: Extended grade with 0 °C to 100 °C operation and RoHS compliance supports typical commercial and industrial deployment environments.
- Series Configuration & Power Features: Arria 10 family capabilities such as dynamic/partial reconfiguration and power‑saving technologies give designers options for power and system management.
Why Choose 10AX090U2F45E2LG?
The 10AX090U2F45E2LG Arria 10 GX device positions itself for mid‑range, performance‑focused designs that require a combination of high logic count, significant embedded memory and extensive I/O. Its package and supply specifications suit compact board designs where on‑chip resources reduce external component count and simplify system architecture.
Design teams targeting wireless/wireline communications, high‑performance computing acceleration, broadcast processing or medical imaging will find the device’s capacity and family‑level features useful for scalable implementations, while RoHS compliance and extended‑grade temperature support align with commercial and many industrial deployment scenarios.
If you would like pricing, availability or a formal quote for 10AX090U2F45E2LG, submit a quote request or contact the sales channel to request a quote and technical support.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
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