10AX090U2F45I2SG

IC FPGA 480 I/O 1932FCBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 480 59234304 900000 1932-BBGA, FCBGA

Quantity 175 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FCBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O480Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs339620Number of Logic Elements/Cells900000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits59234304

Overview of 10AX090U2F45I2SG – Arria 10 GX FPGA, 900,000 logic elements, 1932‑FCBGA

The 10AX090U2F45I2SG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 1932‑ball FCBGA package. It is a 20 nm mid‑range FPGA family device designed for high-performance, power‑efficient programmable logic and system integration.

Targeted markets and use cases documented for the Arria 10 family include wireless and wireline networking, broadcast, computing and storage, medical imaging, and military systems where a combination of logic density, embedded memory, high‑speed transceivers, and flexible I/O is required.

Key Features

  • Core Logic  900,000 logic elements (logic element cells) providing substantial programmable logic capacity for complex FPGA designs.
  • Embedded Memory  Total on‑device RAM of 59,234,304 bits to support large buffering, caching, and memory‑intensive processing tasks.
  • I/O and Package  480 user I/O pins; supplied in a 1932‑FCBGA (45 × 45 mm) surface‑mount package for high‑pin‑count system integration.
  • Power and Voltage  Operates from 870 mV to 980 mV core supply; part of a device family described as power‑efficient on a 20 nm process.
  • Temperature & Grade  Industrial temperature range from −40 °C to 100 °C; RoHS‑compliant.
  • High‑Speed SerDes & Protocol Support  Family documentation references low‑power serial transceivers and support for protocols including PCIe Gen1/Gen2/Gen3, 10 Gbps Ethernet, and Interlaken for high‑bandwidth link implementations.
  • DSP & System Integration  Variable‑precision DSP blocks and device variants supporting SoC integration with a hard processor system are described for the Arria 10 family.
  • Clocking & Reconfiguration  Rich clock network and PLL capabilities, plus support for dynamic and partial reconfiguration as documented for the device family.

Typical Applications

  • Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul systems that require programmable signal processing and high I/O density.
  • Wireline Networking  Line cards, 40G/100G muxponders, and transponders where high‑speed serial interfaces and protocol hard IP accelerate system design.
  • Broadcast & Professional AV  Studio switches and video transport applications leveraging large logic capacity and embedded memory for real‑time processing.
  • Computing & Storage  Server acceleration and flash cache applications that benefit from large on‑chip memory and DSP resources.
  • Defense & Medical Systems  Radar, guidance, diagnostic imaging and other systems that require industrial temperature operation and high integration.

Unique Advantages

  • High Logic Density: 900,000 logic elements enable consolidation of complex functions into a single device, reducing board count and system BOM.
  • Large Embedded Memory: Nearly 59.3 Mb of on‑device RAM supports buffering, look‑up tables, and memory‑centric algorithms without external memory for many use cases.
  • Protocol & Transceiver Flexibility: Documented support for PCIe Gen1/2/3, 10 Gbps Ethernet, and Interlaken plus low‑power serial transceivers simplifies integration of high‑bandwidth links.
  • Industrial Operating Range: Rated for −40 °C to 100 °C operation and RoHS compliance for deployment in temperature‑sensitive and environmentally regulated applications.
  • System Integration Options: Family features such as variable‑precision DSP blocks, SoC HPS options, rich clocking, and dynamic/partial reconfiguration allow designers to tailor performance and functionality.
  • High‑Pin‑Count Packaging: 1932‑ball FCBGA (45 × 45 mm) package supports extensive I/O and routing for complex system designs.

Why Choose 10AX090U2F45I2SG?

The 10AX090U2F45I2SG provides a combination of large programmable logic capacity, significant embedded memory, and broad I/O/transceiver capability in a single industrial‑grade Arria 10 GX device. Its documented family features—power‑efficient 20 nm architecture, protocol hard IP, DSP resources, and reconfiguration options—make it well suited for mid‑range systems that require both performance and flexibility.

Design teams building networking, broadcast, computing, medical, or defense applications can leverage the device’s density and integration to reduce system complexity, while relying on Intel’s Arria 10 family documentation and guidelines for design and deployment.

Request a quote or submit a pricing request to evaluate 10AX090U2F45I2SG for your next design project.

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