10AX090U3F45E2LG

IC FPGA 480 I/O 1932FCBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 480 59234304 900000 1932-BBGA, FCBGA

Quantity 146 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FCBGA (45x45)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O480Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs339620Number of Logic Elements/Cells900000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits59234304

Overview of 10AX090U3F45E2LG – Arria 10 GX FPGA, 900,000 logic elements

The 10AX090U3F45E2LG is an Intel Arria 10 GX field programmable gate array (FPGA) device built on a 20 nm mid-range architecture. It combines high logic density, large embedded RAM capacity, and advanced interface capabilities to address demanding mid-range applications.

Designed for markets such as wireless, wireline, broadcast, computing and storage, medical, and military systems, this device targets use cases that require substantial on-chip logic, high-bandwidth memory, and numerous I/O connections while supporting power-management and dynamic reconfiguration features.

Key Features

  • Core Logic  Provides 900,000 logic elements to implement complex digital functions and control logic.
  • Embedded Memory  Includes 59,234,304 total RAM bits across on-chip memory blocks for buffering, packet processing, and large LUT-based state machines.
  • I/O and Package  Offers 480 I/O pins and is supplied in a 1932-FCBGA (45×45) package; mounting type is surface mount.
  • Power Supply  Core voltage supply range is 870 mV to 930 mV to support optimized power domains.
  • Operating Range & Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C.
  • Transceivers & Interfaces  Includes support for low-power serial transceivers, enhanced PCS hard IP for Ethernet, and PCIe Gen1/Gen2/Gen3 hard IP as described in the device family overview.
  • DSP and Processing Blocks  Features variable-precision DSP blocks for multi-precision signal processing and computation acceleration.
  • Configuration & Reliability  Supports dynamic and partial reconfiguration, SEU error detection and correction, and integrated power-management capabilities.

Typical Applications

  • Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul implementations leveraging high logic density and on-chip memory.
  • Wireline Networking  40G/100G muxponders, transponders and line cards that require high-speed interfaces and abundant I/O.
  • Broadcast & Pro AV  Studio switches and professional audio/video transport systems benefiting from large on-chip memory and high I/O counts.
  • Computing & Storage  Flash cache, server acceleration, and cloud compute applications that use embedded DSP blocks and significant logic resources for acceleration tasks.
  • Medical & Defense Electronics  Imaging, radar, and secure-communications subsystems that use the device’s reconfiguration and reliability features.

Unique Advantages

  • High logic density: 900,000 logic elements enable implementation of complex algorithms and system-level integration on a single device.
  • Large on-chip memory: 59,234,304 total RAM bits reduce external memory dependency for buffering and data-intensive tasks.
  • High pin-count package: 480 I/Os in a 1932-FCBGA (45×45) package support dense connectivity for multi-channel and multi-protocol designs.
  • Power-optimized core voltage: 870–930 mV supply range supports designs targeting efficient power domains.
  • Flexible interface support: Integrated support for PCIe and high-speed Ethernet hard IP along with low-power transceivers simplifies system-level integration.
  • Run-time adaptability: Dynamic and partial reconfiguration capabilities allow in-field updates and resource remapping without full system downtime.

Why Choose 10AX090U3F45E2LG?

The 10AX090U3F45E2LG positions itself as a high-logic-density, mid-range FPGA suited for designs that require significant on-chip memory, numerous I/Os, and advanced interface options. Its 20 nm Arria 10 GX architecture, combined with DSP blocks, transceiver support, and reconfiguration capabilities, makes it appropriate for network, compute acceleration, broadcast, and advanced embedded systems.

Backed by Intel’s Arria 10 device family features and documentation, this device offers a balance of performance, power-efficiency, and system integration for engineers building scalable, reconfigurable hardware solutions.

Request a quote or submit a pricing request to check availability and pricing for the 10AX090U3F45E2LG.

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