10AX090U3F45I2LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 480 59234304 900000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 1,698 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FCBGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 480 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 339620 | Number of Logic Elements/Cells | 900000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 59234304 |
Overview of 10AX090U3F45I2LG – Arria 10 GX FPGA, 900,000 logic elements
The 10AX090U3F45I2LG is an Intel Arria 10 GX field-programmable gate array (FPGA) supplied in a 1932-FCBGA (45×45) surface-mount package. It delivers a large programmable fabric with 900,000 logic elements and extensive on-chip memory for midrange, high-performance designs.
Designed for power-sensitive, performance-focused applications, this Arria 10 GX device family targets markets such as wireless and wireline communications, broadcast and professional video, computing and storage, and medical and military systems where a balance of throughput and power efficiency is required.
Key Features
- Logic Capacity — 900,000 logic elements and 339,620 logic blocks, providing ample programmable fabric for complex FPGA designs.
- Embedded Memory — 59,234,304 total RAM bits of on-chip memory to support buffers, caches, and high-throughput data processing.
- I/O Density — 480 I/O pins to support wide parallel interfaces and diverse peripheral connectivity.
- Power and Voltage — Core voltage range specified at 870 mV to 930 mV, enabling designs targeting lower core power consumption.
- Package and Mounting — 1932-FCBGA (45×45) package, surface-mount mounting for high-density board implementations.
- Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet a broad set of environmental requirements.
- Family-Level Capabilities — Arria 10 device family features described in the product overview include adaptive logic modules, variable-precision DSP blocks, embedded memory block types, clock networks with PLLs, low-power serial transceivers, PCIe hard IP, enhanced PCS hard IP for high-speed protocols, and dynamic/partial reconfiguration.
- Compliance — RoHS-compliant construction.
Typical Applications
- Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul equipment that require programmable logic and high data throughput.
- Wireline Networking — 40G/100G muxponders, transponders, and line cards for aggregation and bridging where large logic and on-chip memory support protocol processing and packet buffering.
- Broadcast and Professional Video — Studio switches, transport and videoconferencing equipment that need flexible I/O and real-time processing.
- Computing and Storage — Server acceleration, flash cache, and cloud infrastructure functions that leverage dense logic and embedded memory for low-latency data paths.
- Medical and Defense Systems — Diagnostic imaging and radar/electronic warfare applications benefiting from high logic capacity and industrial temperature operation.
Unique Advantages
- High-density programmable fabric: 900,000 logic elements enable integration of complex algorithms and large custom accelerators on a single device, reducing board-level component count.
- Large on-chip memory: 59,234,304 RAM bits support wide buffering and local data storage requirements, minimizing external memory bandwidth needs.
- Extensive I/O availability: 480 I/O pins allow flexible interface mapping and support for multiple parallel and high-speed connections.
- Industrial temperature rating: −40 °C to 100 °C specification supports deployments across a broad range of operating environments.
- Compact, high-density package: 1932-FCBGA (45×45) packaging enables high pin-count capability in a compact footprint for space-constrained designs.
- Power-optimized core voltage: Core supply range of 870 mV to 930 mV supports designs targeting power-efficient operation.
Why Choose 10AX090U3F45I2LG?
The 10AX090U3F45I2LG Arria 10 GX FPGA combines large logic and memory resources with a high I/O count and industrial temperature capability, making it suitable for demanding midrange applications that require a balance of performance and power efficiency. Its family-level features—such as variable-precision DSP blocks, embedded memory architectures, clocking PLLs, and support for high-speed serial protocols—align with use cases in communications, video, storage acceleration, and instrumentation.
For engineering teams needing a scalable, robust programmable platform, this device provides a high level of integration to simplify board design, reduce BOM, and support long-term application development within the Arria 10 ecosystem.
Request a quote or submit an RFQ for part number 10AX090U3F45I2LG to check pricing and availability for your next design.

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