10AX090U3F45I2LG

IC FPGA 480 I/O 1932FCBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 480 59234304 900000 1932-BBGA, FCBGA

Quantity 1,698 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FCBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O480Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs339620Number of Logic Elements/Cells900000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits59234304

Overview of 10AX090U3F45I2LG – Arria 10 GX FPGA, 900,000 logic elements

The 10AX090U3F45I2LG is an Intel Arria 10 GX field-programmable gate array (FPGA) supplied in a 1932-FCBGA (45×45) surface-mount package. It delivers a large programmable fabric with 900,000 logic elements and extensive on-chip memory for midrange, high-performance designs.

Designed for power-sensitive, performance-focused applications, this Arria 10 GX device family targets markets such as wireless and wireline communications, broadcast and professional video, computing and storage, and medical and military systems where a balance of throughput and power efficiency is required.

Key Features

  • Logic Capacity — 900,000 logic elements and 339,620 logic blocks, providing ample programmable fabric for complex FPGA designs.
  • Embedded Memory — 59,234,304 total RAM bits of on-chip memory to support buffers, caches, and high-throughput data processing.
  • I/O Density — 480 I/O pins to support wide parallel interfaces and diverse peripheral connectivity.
  • Power and Voltage — Core voltage range specified at 870 mV to 930 mV, enabling designs targeting lower core power consumption.
  • Package and Mounting — 1932-FCBGA (45×45) package, surface-mount mounting for high-density board implementations.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet a broad set of environmental requirements.
  • Family-Level Capabilities — Arria 10 device family features described in the product overview include adaptive logic modules, variable-precision DSP blocks, embedded memory block types, clock networks with PLLs, low-power serial transceivers, PCIe hard IP, enhanced PCS hard IP for high-speed protocols, and dynamic/partial reconfiguration.
  • Compliance — RoHS-compliant construction.

Typical Applications

  • Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul equipment that require programmable logic and high data throughput.
  • Wireline Networking — 40G/100G muxponders, transponders, and line cards for aggregation and bridging where large logic and on-chip memory support protocol processing and packet buffering.
  • Broadcast and Professional Video — Studio switches, transport and videoconferencing equipment that need flexible I/O and real-time processing.
  • Computing and Storage — Server acceleration, flash cache, and cloud infrastructure functions that leverage dense logic and embedded memory for low-latency data paths.
  • Medical and Defense Systems — Diagnostic imaging and radar/electronic warfare applications benefiting from high logic capacity and industrial temperature operation.

Unique Advantages

  • High-density programmable fabric: 900,000 logic elements enable integration of complex algorithms and large custom accelerators on a single device, reducing board-level component count.
  • Large on-chip memory: 59,234,304 RAM bits support wide buffering and local data storage requirements, minimizing external memory bandwidth needs.
  • Extensive I/O availability: 480 I/O pins allow flexible interface mapping and support for multiple parallel and high-speed connections.
  • Industrial temperature rating: −40 °C to 100 °C specification supports deployments across a broad range of operating environments.
  • Compact, high-density package: 1932-FCBGA (45×45) packaging enables high pin-count capability in a compact footprint for space-constrained designs.
  • Power-optimized core voltage: Core supply range of 870 mV to 930 mV supports designs targeting power-efficient operation.

Why Choose 10AX090U3F45I2LG?

The 10AX090U3F45I2LG Arria 10 GX FPGA combines large logic and memory resources with a high I/O count and industrial temperature capability, making it suitable for demanding midrange applications that require a balance of performance and power efficiency. Its family-level features—such as variable-precision DSP blocks, embedded memory architectures, clocking PLLs, and support for high-speed serial protocols—align with use cases in communications, video, storage acceleration, and instrumentation.

For engineering teams needing a scalable, robust programmable platform, this device provides a high level of integration to simplify board design, reduce BOM, and support long-term application development within the Arria 10 ecosystem.

Request a quote or submit an RFQ for part number 10AX090U3F45I2LG to check pricing and availability for your next design.

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