10AX090U4F45E3SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 480 59234304 900000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 1,023 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FCBGA (45x45) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 480 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 339620 | Number of Logic Elements/Cells | 900000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 59234304 |
Overview of 10AX090U4F45E3SG – Arria 10 GX FPGA, 900000 logic elements, 1932-FCBGA
The 10AX090U4F45E3SG is an Intel Arria 10 GX field programmable gate array (FPGA) packaged in a 1932-FCBGA. Built for mid-range, high-performance and power-sensitive applications, this device combines a large logic capacity with extensive on-chip memory and I/O resources.
Designed for applications across wireless, wireline, broadcast, computing and other sectors, the device leverages series-level capabilities such as variable‑precision DSP blocks, embedded memory, PLL-based clock networks, high-speed serial transceivers and integrated hard IP to support complex system designs.
Key Features
- Logic Capacity — Contains 900000 logic elements for implementing large, complex digital designs.
- Embedded Memory — 59,234,304 total RAM bits to support large buffering, on-chip data storage and memory-intensive algorithms.
- I/O and Package — 480 user I/O pins in a 1932-BBGA / 1932-FCBGA supplier package (1932-FCBGA (45x45)); surface-mount package suitable for high-density board designs.
- Core Power — Core voltage specified at 870 mV to 930 mV to match system power architectures and enable power-optimized operation.
- Operating Range & Grade — Extended grade with an operating temperature range of 0 °C to 100 °C for deployment in temperature-demanding environments.
- Series-Level Silicon Capabilities — Arria 10 family features cited in the device overview include variable-precision DSP blocks, clock networks and PLL clock sources, PCIe Gen1/Gen2/Gen3 hard IP, low-power serial transceivers, and enhanced configuration options such as dynamic and partial reconfiguration.
- Standards & Compliance — RoHS compliant.
Typical Applications
- Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul equipment leveraging on-chip DSP and high I/O count.
- Wireline Networking — Line cards, muxponders and transponders (e.g., 40G/100G) using embedded memory and hard IP for high-throughput data paths.
- Broadcast & Media — Studio switches, video transport and professional audio/video processing that benefit from large logic and memory resources.
- Computing & Storage — Server acceleration, flash cache and cloud computing server tasks requiring sizable on-chip RAM and high logic density.
- Medical & Instrumentation — Diagnostic imaging and medical scanners that require configurable, high-performance logic and memory.
Unique Advantages
- High logic density: 900000 logic elements allow implementation of large, integrated designs without external glue logic.
- Substantial on-chip RAM: 59,234,304 bits of embedded memory reduce dependence on external memory and accelerate data paths.
- Rich I/O and package options: 480 I/Os in a 1932-FCBGA package support dense board-level connectivity and high pin-count interfaces.
- Integrated system features: Series-level support for DSP blocks, PLLs, PCIe hard IP and serial transceivers simplifies system integration and shortens development time.
- Power-aware core: Core supply specified at 870–930 mV to align with power-optimized designs and series-level low-power technologies.
- Extended-grade operation: 0 °C to 100 °C operating temperature and RoHS compliance support deployment in varied environments while meeting regulatory requirements.
Why Choose 10AX090U4F45E3SG?
The 10AX090U4F45E3SG positions itself as a high-capacity, feature-rich Arria 10 GX device suitable for mid-range, performance- and power-sensitive designs. With 900000 logic elements, large embedded RAM, broad I/O and series-level silicon capabilities such as DSP blocks, PLLs, transceivers and PCIe hard IP, this FPGA is configured to consolidate functions and reduce external component count.
Choose this device when you need a scalable, tightly integrated FPGA solution for networking, wireless infrastructure, broadcast, compute acceleration or imaging applications where on-chip memory, logic density and I/O bandwidth are decisive factors.
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