10AX090U4F45I3SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 480 59234304 900000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 485 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FCBGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 480 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 339620 | Number of Logic Elements/Cells | 900000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 59234304 |
Overview of 10AX090U4F45I3SG – Arria 10 GX FPGA (900,000 logic elements, 1932‑FCBGA)
The 10AX090U4F45I3SG is an Intel Arria 10 GX field-programmable gate array (FPGA) in a 1932‑FCBGA (45×45) package, delivering 900,000 logic elements and extensive embedded memory. Built on the Arria 10 20 nm mid-range architecture, this device targets high-performance, power-sensitive applications across wireless, wireline, broadcast, computing, medical and defense markets.
With 480 I/Os, 59,234,304 bits of on-chip RAM and industrial-grade operating range, the device balances dense logic, large memory, and robust I/O in a surface-mount package for demanding embedded and networked designs.
Key Features
- Core Density 900,000 logic elements provide high integration for complex logic, state machines and custom accelerators.
- Embedded Memory 59,234,304 total RAM bits of on-chip memory to support large buffers, caches and data-path storage.
- I/O and Packaging 480 general-purpose I/Os in a 1932‑FCBGA (45×45) surface-mount package for dense board-level connectivity.
- Arria 10 GX Architecture (20 nm) Series-level features include variable-precision DSP blocks, scalable clock networks, and support for external memory interfaces and high-speed serial protocols as described for Arria 10 GX devices.
- High-Speed Protocol Support (Series Capability) Arria 10 GX device family documentation notes support for PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS for Interlaken and 10 Gbps Ethernet, and low-power serial transceivers.
- Voltage and Power Device core supply range 870 mV to 930 mV, aligning with the series' power-efficiency focus.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
- Configuration and Reliability (Series-Level) Arria 10 family documentation includes features such as dynamic and partial reconfiguration, SEU error detection and correction, and power management capabilities.
Typical Applications
- Wireless Infrastructure — Channel and switch cards or mobile backhaul nodes leveraging high logic density and on-chip memory for real-time processing.
- High‑Speed Wireline — 40G/100G muxponders, transponders and line cards that benefit from PCIe and high-speed serial protocol support documented for the Arria 10 GX family.
- Broadcast and Professional AV — Studio switches, video transport and conferencing systems using dense I/O and embedded memory for media buffering and transport processing.
- Compute Acceleration and Storage — Flash cache, server acceleration and cloud compute offload where large on-chip RAM and logic elements reduce external memory dependence.
- Medical and Defense Systems — Diagnostic imaging, radar and secure communications that need industrial temperature range and high integration.
Unique Advantages
- High logic integration: 900,000 logic elements let you consolidate complex functions and reduce external components.
- Substantial on-chip memory: 59,234,304 bits of embedded RAM support large data queues, frame buffers and cache-like functions without immediate reliance on external DRAM.
- Dense I/O and compact package: 480 I/Os in a 1932‑FCBGA (45×45) package enable high pin-count designs in a standard surface-mount form factor.
- Industrial readiness: −40 °C to 100 °C operating range and industrial grade classification for deployment in demanding environments.
- Power-conscious architecture: Core supply range of 870 mV–930 mV and Arria 10 series power-saving technologies support energy-efficient designs.
- Series-level protocol and IP support: Arria 10 GX documentation provides PCIe Gen1/2/3 hard IP, enhanced PCS for Interlaken and 10 Gbps Ethernet, and low-power serial transceivers to simplify high-speed interface design.
Why Choose 10AX090U4F45I3SG?
The 10AX090U4F45I3SG brings Arria 10 GX series capabilities into a high-density, industrial-grade device suited for mid-range applications that require a balance of performance, memory capacity and I/O. Its combination of 900,000 logic elements, large embedded RAM and a 480‑I/O 1932‑FCBGA package makes it appropriate for network infrastructure, compute acceleration and advanced signal processing designs.
Backed by Intel Arria 10 series architecture and documented features such as configurable DSP resources, reconfiguration support and hardened protocol IP, this FPGA provides a scalable platform for teams building power-sensitive, performance-driven systems while maintaining long-term ecosystem and documentation support.
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