10AX090U2F45I1SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 480 59234304 900000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 137 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FCBGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 480 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 339620 | Number of Logic Elements/Cells | 900000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 59234304 |
Overview of 10AX090U2F45I1SG – Arria 10 GX FPGA, 900,000 Logic Elements
The 10AX090U2F45I1SG is an Intel Arria 10 GX field-programmable gate array (FPGA) in a 1932-FCBGA (45×45) package, offering 900,000 logic elements, 59,234,304 bits of embedded RAM, and 480 general-purpose I/O. This device is a member of the Arria 10 family of 20 nm mid-range FPGAs and SoCs, designed for performance- and power-sensitive midrange applications.
Built for surface-mount assembly and rated for industrial operating temperatures from -40 °C to 100 °C, the device supports a low-voltage core supply range of 870 mV to 980 mV and is RoHS compliant.
Key Features
- Logic Capacity Provides 900,000 logic elements for complex combinational and sequential designs, enabling large-scale programmable logic integration.
- Embedded Memory Includes 59,234,304 bits of on-chip RAM to support high-bandwidth buffering, packet processing, and algorithmic datasets.
- I/O and Package 480 I/O pins in a 1932-FCBGA (45×45) package (package case: 1932-BBGA, FCBGA); surface-mount form factor suitable for compact, high-density board designs.
- Power and Thermal Core supply range of 870 mV–980 mV and an industrial operating temperature range of -40 °C to 100 °C for stable operation across demanding environments.
- Device Family Architecture Arria 10 family features a 20 nm mid-range FPGA architecture focused on higher performance and improved power efficiency for midrange applications.
- DSP and Compute Blocks Variable-precision DSP blocks and adaptive logic modules are available in the Arria 10 family to accelerate signal processing and arithmetic-heavy workloads.
- High-Speed Interfaces Family-level support for high-speed IP such as PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS for 10 Gbps Ethernet and Interlaken, and low-power serial transceivers for board-level connectivity.
- Clocking and PLLs Advanced clock networks with fractional synthesis and multiple PLL clock sources to support complex timing domains and multi-rate designs.
- Reconfiguration & Power Management Support for dynamic and partial reconfiguration and integrated power-management features at the device-family level to optimize runtime power.
- Compliance RoHS compliant and specified for industrial-grade operating conditions.
Typical Applications
- Wireless Infrastructure Channel and switch cards where programmable logic and embedded memory accelerate baseband processing and backhaul functionality.
- High-Speed Networking Line cards, muxponders, and transponders that require high I/O density and hard IP for PCIe and multi-gigabit Ethernet interfaces.
- Broadcast and Professional AV Studio switching and transport systems that benefit from large on-chip RAM and flexible I/O for video/audio processing.
- Compute and Storage Acceleration Server-side acceleration and flash-cache controller implementations using dense logic and DSP resources for data-path offload.
Unique Advantages
- High logic and memory integration: 900,000 logic elements paired with over 59 million bits of on-chip RAM reduce the need for external buffering and simplify board-level memory architecture.
- Industrial temperature range: Rated from -40 °C to 100 °C to meet the thermal requirements of many embedded and industrial deployments.
- Compact, high-density packaging: 1932-FCBGA (45×45) package concentrates I/O and logic in a compact footprint for space-constrained systems.
- Power-aware core supply: Narrow core voltage range (870 mV–980 mV) supports predictable power budgeting and system-level power optimization.
- Family-level system features: Arria 10 family capabilities such as variable-precision DSP, robust clocking, PCIe hard IP, and serial transceivers enable versatile system integration.
- Regulatory and assembly readiness: Surface-mount package and RoHS compliance facilitate modern PCB assembly and environmental requirements.
Why Choose 10AX090U2F45I1SG?
The 10AX090U2F45I1SG Arria 10 GX FPGA combines large-scale programmable logic and embedded memory with family-proven system features to deliver a solution targeted at performance- and power-sensitive midrange applications. Its industrial temperature rating, compact 1932-FCBGA package, and substantial I/O count make it suitable for high-density, mission-critical designs across wireless, networking, broadcast, and compute acceleration markets.
Designed as part of the Arria 10 device family, the part benefits from device-level capabilities such as advanced DSP blocks, flexible clocking, and high-speed interface IP, offering a scalable path for developers who need a programmable platform with strong integration and predictable power and thermal characteristics.
Request a quote or submit an inquiry to receive pricing and availability information for the 10AX090U2F45I1SG Arria 10 GX FPGA.

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