10AX115N4F40I3SGE2
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 600 68857856 1150000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,455 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FCBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 427200 | Number of Logic Elements/Cells | 1150000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 68857856 |
Overview of 10AX115N4F40I3SGE2 – Arria 10 GX FPGA, Industrial-grade FCBGA
The Intel Arria 10 GX FPGA 10AX115N4F40I3SGE2 is an industrial-grade, surface-mount field programmable gate array in a 1517-FCBGA (40×40) package. It provides a large programmable fabric and high on-chip memory capacity for mid-range, performance-sensitive applications where power efficiency and integration are important.
Built on the Arria 10 device family architecture, this device targets applications across wireless, wireline, broadcast, computing, storage and other systems that require large logic capacity, extensive I/O and configurable high-performance blocks.
Key Features
- Programmable Logic — 1,150,000 logic elements delivering substantial capacity for complex digital designs and custom hardware acceleration.
- On‑Chip Memory — 68,857,856 total RAM bits for embedded buffering, caching and state storage within the FPGA fabric.
- I/O Density — 600 user I/O pins to support broad connectivity to peripherals, memory interfaces and multi-channel systems.
- Package & Mounting — 1517-BBGA / 1517-FCBGA (40×40) package in a surface-mount form factor suitable for compact board-level integration.
- Power Supply — Core voltage range 870 mV to 930 mV, reflecting device operating requirements for power planning and regulator selection.
- Operating Temperature — −40 °C to 100 °C rating for deployment in industrial-temperature environments.
- Device Family Capabilities — Arria 10 family features such as variable‑precision DSP blocks, embedded memory blocks, PLLs and transceiver/PCIe/10G Ethernet support (family-level capabilities referenced from Arria 10 device overview).
- Compliance — RoHS compliant, meeting common environmental material requirements.
Typical Applications
- Wireless Infrastructure — Implement channel processing, baseband acceleration and interface logic where large logic capacity and on-chip memory are required.
- Wireline and Networking — Use for line cards, mux/transport functions and protocol bridging leveraging abundant I/O and embedded memory.
- Video and Broadcast Systems — Process and route high‑bandwidth video streams with on‑chip memory for buffering and reformatting.
- Compute and Storage Acceleration — Offload workload-specific functions and cache management using dense logic and RAM resources.
Unique Advantages
- High Logic Capacity: 1,150,000 logic elements enable large, consolidated hardware designs and complex algorithm implementation on a single device.
- Large Embedded Memory: Nearly 69 million RAM bits reduce external memory dependencies and improve data locality for latency-sensitive tasks.
- Extensive I/O: 600 I/O pins provide flexibility to connect to multiple peripherals, memory interfaces and mezzanine cards without additional bridge logic.
- Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in temperature-challenging industrial environments.
- Family-Level Integration: Arria 10 family features such as DSP blocks and high-speed transceiver support enable implementation of signal processing and high-throughput interfaces.
- Surface-Mount FCBGA Package: 1517-FCBGA (40×40) offers a compact, board-friendly footprint for dense system designs.
Why Choose 10AX115N4F40I3SGE2?
The 10AX115N4F40I3SGE2 combines large FPGA fabric, substantial embedded memory and high I/O density in an industrial-temperature, surface-mount FCBGA package. It is positioned for designers who need a scalable, integrated platform for mid-range, performance-sensitive systems across communications, broadcast, compute and storage domains.
Choosing this Arria 10 GX device provides a balance of logic capacity, memory resources and system connectivity that supports complex implementations while enabling power and board-level integration decisions tied directly to the device’s supplied voltage range and package characteristics.
Request a quote or submit an inquiry to get pricing and availability for the 10AX115N4F40I3SGE2 and to discuss volume, lead time and integration support.

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