10AX115N4F45E3SG

IC FPGA 768 I/O 1932FCBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 768 68857856 1150000 1932-BBGA, FCBGA

Quantity 1,243 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FCBGA (45x45)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O768Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs427200Number of Logic Elements/Cells1150000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits68857856

Overview of 10AX115N4F45E3SG – Arria 10 GX FPGA (1932-FCBGA, Extended Grade)

The 10AX115N4F45E3SG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) offered in a 1932-FCBGA (45×45) package and Extended grade. It is part of the Arria 10 family of 20 nm mid-range FPGAs designed for high-performance, power-sensitive applications across wireless, wireline, broadcast, computing, medical, and defense markets.

Built to deliver large on-chip logic and memory capacity, this device provides 1,150,000 logic elements, 68,857,856 total RAM bits and 768 I/O pins, with a supply voltage range of 870 mV to 930 mV and an operating temperature range of 0 °C to 100 °C.

Key Features

  • Core capacity — 1,150,000 logic elements to implement complex programmable logic and high-density designs.
  • Embedded memory — 68,857,856 total RAM bits supported by embedded memory blocks and multiple memory configurations for buffering and on-chip storage.
  • I/O and transceivers — 768 I/O pins with family support for low-power serial transceivers and physical coding sublayer (PCS) features for high-speed interfaces.
  • High-speed IP support — Arria 10 family includes PCIe Gen1/Gen2/Gen3 Hard IP and enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet support.
  • DSP and processing — Variable-precision DSP blocks and architecture elements such as Adaptive Logic Modules for signal processing and algorithm acceleration.
  • Clocking and reconfiguration — Advanced clock networks with PLL clock sources, fractional synthesis, I/O PLLs, and support for dynamic and partial reconfiguration.
  • Power and supply — Designed for operation with a core supply range of 870 mV to 930 mV and includes power-management capabilities highlighted in the device documentation.
  • Package and mounting — 1932-FCBGA (45×45) package, surface-mount mounting type suitable for compact, production assemblies.
  • Operating grade — Extended grade operation from 0 °C to 100 °C for deployments that require above-commercial temperature coverage.

Typical Applications

  • Wireless infrastructure: Channel cards and switch cards in remote radio heads and mobile backhaul systems leveraging high logic and DSP capacity.
  • Wireline communications: 40G/100G muxponders, transponders and 100G line cards that benefit from integrated high-speed interfaces and hard IP.
  • Broadcast and pro AV: Studio switches, transport and video-processing applications that use large embedded memory and flexible I/O.
  • Computing and storage: Server acceleration and flash-caching functions that leverage dense logic, on-chip RAM and DSP resources.
  • Medical and defense systems: Diagnostic imaging, radar and secure communications where reconfigurable logic and high I/O density are required.

Unique Advantages

  • High integration density: 1,150,000 logic elements and substantial embedded RAM enable complex system functions on a single device, reducing external components.
  • Large on-chip memory: Nearly 69 million RAM bits provide capacity for frame buffering, packet processing and large-state applications without relying solely on external memory.
  • Extensive I/O and interface support: 768 I/Os combined with family-level support for high-speed serial transceivers and PCIe/10 GbE hard IP simplifies system-level connectivity.
  • Power-aware architecture: As a 20 nm Arria 10 family device with documented power-management features, it supports power-sensitive mid-range designs.
  • Flexible clocking and reconfiguration: Advanced PLLs, clock networks and support for dynamic/partial reconfiguration allow adaptive performance tuning and in-field updates.
  • Production-ready package: 1932-FCBGA (45×45) surface-mount package and Extended grade operation (0 °C to 100 °C) suit demanding board-level deployments.

Why Choose 10AX115N4F45E3SG?

The 10AX115N4F45E3SG positions itself as a high-capacity, mid-range FPGA option within the Intel Arria 10 family, combining large logic and memory resources with extensive I/O and hard IP features. It is aimed at engineers and system designers who need a power-conscious, reconfigurable platform for high-throughput signal processing, networking, storage and broadcast applications.

Backed by Arria 10 device documentation and family-level feature sets, this device supports scalable designs that can leverage dynamic reconfiguration, integrated DSP blocks and high-speed interface IP to reduce system complexity and accelerate time to market.

Request a quote or submit an inquiry to obtain pricing, lead time and availability for 10AX115N4F45E3SG.

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