10AX115N4F45I3SG

IC FPGA 768 I/O 1932FCBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 768 68857856 1150000 1932-BBGA, FCBGA

Quantity 274 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FCBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O768Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs427200Number of Logic Elements/Cells1150000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits68857856

Overview of 10AX115N4F45I3SG – Arria 10 GX Field Programmable Gate Array (FPGA) IC 768 68857856 1,150,000 1932-BBGA, FCBGA

The 10AX115N4F45I3SG is an Intel Arria 10 GX family FPGA device — a 20 nm, mid-range, high-performance programmable logic IC designed for demanding, power-sensitive applications. This device combines a very large logic capacity with extensive embedded memory and high-density I/O to address a broad set of system functions.

Typical target markets include wireless and wireline communications, broadcast, computing and storage, medical imaging, and military applications. Key value stems from its large logic element count, substantial on-chip RAM, high I/O density, industrial operating range, and package options that support high-pin-count system designs.

Key Features

  • Core Logic  1,150,000 logic elements suitable for complex, high-density programmable logic implementations.
  • Embedded Memory  68,857,856 total RAM bits on-chip to support large buffers, caches, and state storage without immediate external memory dependencies.
  • I/O Capacity  768 I/O pins to support wide parallel interfaces, multiple memory channels, and dense system connectivity.
  • High-speed Interfaces & Hard IP  Family-level features include PCIe Gen1/Gen2/Gen3 hard IP and enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, enabling integration of common high-speed protocols (see Arria 10 family documentation for details).
  • Transceivers & SerDes  Low-power serial transceivers are part of the Arria 10 feature set to support multi-gigabit links and communications protocols.
  • DSP and SoC Capabilities  Variable-precision DSP blocks and SoC options (Hard Processor System) are available within the Arria 10 family to accelerate signal processing and system control tasks.
  • Package & Mounting  1932-ball FCBGA package (45 × 45 mm footprint) with surface-mount mounting for high-density board designs.
  • Power and Voltage  Operates from 870 mV to 930 mV core supply, supporting low-voltage system designs and power-sensitive applications.
  • Operating Temperature  Industrial-grade operation from −40 °C to 100 °C for deployment in thermally demanding environments.

Typical Applications

  • Wireless Infrastructure  High-density channel processing, switch cards, and remote radio head functions benefitting from large logic and on-chip memory.
  • Wireline and Optical Transport  40G/100G muxponder, transponder, and line card functions using integrated hard IP for high-speed serial protocols.
  • Broadcast and Professional AV  Studio switches and video processing pipelines that require high I/O counts and substantial on-chip buffering.
  • Computing and Storage Acceleration  Flash cache, server acceleration, and cloud compute offload where dense logic and embedded memory reduce external component needs.
  • Medical and Industrial Systems  Diagnostic imaging and industrial control systems that require robust temperature range and large programmable logic resources.

Unique Advantages

  • Massive Logic Capacity: 1,150,000 logic elements enable integration of multiple large functions into a single device, reducing board-level complexity.
  • Large On-Chip Memory: 68,857,856 RAM bits provide substantial internal buffering and memory for data-heavy processing without immediate reliance on external DRAM.
  • High I/O Density: 768 I/O pins allow wide parallel interfaces and multiple peripheral connections from a single FPGA.
  • Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in thermally challenging deployments.
  • High-Pin-Count FCBGA Package: 1932-ball (45 × 45 mm) FCBGA supports high routing density and signal integrity for complex system designs.
  • Low-Voltage Core: 870 mV–930 mV supply supports low-power system designs and aligns with modern power-management approaches.

Why Choose 10AX115N4F45I3SG?

The 10AX115N4F45I3SG positions itself as a high-capacity, feature-rich member of the Intel Arria 10 GX family, delivering a balance of logic density, embedded memory, and I/O density for mid-range systems that require substantial programmable resources. Its industrial temperature rating and FCBGA packaging make it suitable for applications where reliability and integration density are priorities.

This device is well suited to engineering teams building communications, broadcast, compute-acceleration, medical imaging, or industrial control solutions that need to consolidate functionality into a single FPGA while retaining access to family-level hard IP for common high-speed interfaces and signal-processing blocks.

Request a quote or submit a pricing and availability inquiry for 10AX115N4F45I3SG to evaluate fit for your next design and to obtain lead-time information.

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