10AX115R1F40I1SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 342 68857856 1150000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 22 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 9 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FCBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 342 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 427200 | Number of Logic Elements/Cells | 1150000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 68857856 |
Overview of 10AX115R1F40I1SG – Arria 10 GX Field Programmable Gate Array (FPGA), 1517-FCBGA
The 10AX115R1F40I1SG is an Intel Arria 10 GX series field-programmable gate array (FPGA) supplied in a 1517-FCBGA (40×40) surface-mount package. It is part of the Arria 10 device family of 20 nm mid-range FPGAs and SoCs, designed for high-performance, power-efficient applications across wireless, wireline, broadcast, computing, medical, and military markets.
This device delivers high logic density and on-chip memory capacity alongside series-level capabilities such as embedded DSP blocks, flexible clocking and PLLs, and high-speed serial/transceiver support, enabling implementation of complex, power-sensitive designs in industrial environments.
Key Features
- Logic Capacity — 1,150,000 logic elements for implementing large, complex FPGA designs and custom hardware acceleration.
- On-chip Memory — 68,857,856 total RAM bits to support buffering, packet processing, and data-path implementations without immediate external memory dependence.
- I/O and Packaging — 342 device I/Os in a 1517-FCBGA (1517-BBGA/FCBGA) 40×40 package; surface-mount compatible for dense board-level integration.
- Power — Core supply range 870 mV to 980 mV, enabling low-voltage operation consistent with modern power architectures.
- Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for reliable performance in demanding environments.
- Embedded DSP and Memory Blocks — Series-level Arria 10 features include variable-precision DSP blocks and multiple embedded memory block types for signal processing and algorithm acceleration.
- Clocking and PLLs — Advanced clock networks and fractional synthesis/I/O PLLs (Arria 10 family features) for flexible timing architectures.
- High-speed Connectivity (Series Features) — Arria 10 device family supports PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and low-power serial transceivers for high-speed link implementations.
- Compliance — RoHS compliant.
Typical Applications
- Wireless Infrastructure — Channel and switch cards, remote radio head processing, and mobile backhaul systems using high logic density and embedded DSP resources.
- Wireline Networking — 40G/100G muxponders, transponders, and line cards where integrated transceivers and high I/O count enable dense packet and framing implementations.
- Broadcast and Media — Studio switches, video transport, and professional audio/video processing leveraging on-chip memory and DSP blocks.
- Compute and Storage Acceleration — Flash cache controllers, server acceleration, and cloud compute offload that use large FPGA fabric and memory for data-path acceleration.
- Medical and Defense Systems — Diagnostic imaging, radar, and secure communications applications requiring industrial temperature operation and high logic/memory capacity.
Unique Advantages
- High Logic Density: 1,150,000 logic elements provide headroom for complex custom logic, algorithm implementation, and hardware acceleration.
- Substantial On-Chip RAM: Nearly 69 million bits of RAM reduce reliance on external memory for many buffering and data-processing tasks.
- Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in harsh and temperature-variable environments.
- Low-Voltage Core: 870 mV–980 mV supply range aligns with modern, efficient power-rail designs for lower overall system power.
- Broad Connectivity Support: Series-level support for PCIe Gen1/2/3, Interlaken, and 10 Gbps Ethernet enables integration into high-speed I/O systems.
- Compact, Surface-Mount Package: 1517-FCBGA (40×40) packaging and surface-mount compatibility enable compact PCB layouts for space-constrained designs.
Why Choose 10AX115R1F40I1SG?
The 10AX115R1F40I1SG positions itself as a high-density, industrial-grade FPGA option within the Intel Arria 10 family, combining over one million logic elements with tens of megabits of embedded RAM and a large I/O count. It is suited for engineers designing power-sensitive, high-performance mid-range applications that require integrated DSP resources, flexible clocking, and series-level high-speed connectivity.
As a member of the Arria 10 device family, this FPGA provides a platform-level feature set—such as embedded memory blocks, DSP capabilities, PLL-based clocking, and transceiver support—that helps scale designs while maintaining reliability and predictable electrical requirements across industrial temperature ranges.
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