10AX115R2F40E1SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 342 68857856 1150000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 877 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FCBGA (40x40) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 342 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 427200 | Number of Logic Elements/Cells | 1150000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 68857856 |
Overview of 10AX115R2F40E1SG – Arria 10 GX FPGA, 1517-FCBGA (40×40)
The 10AX115R2F40E1SG is an Arria 10 GX field programmable gate array (FPGA) device from Intel’s Arria 10 family. It is a 20 nm mid-range FPGA intended for high-performance, power-sensitive applications and SoC designs.
Designed for markets such as wireless, wireline, broadcast, computing and storage, and medical imaging, this device delivers high logic density, substantial on-chip memory, and a compact FCBGA package for board-level integration.
Key Features
- Programmable Logic Capacity — 1,150,000 logic elements, providing high-density programmable logic for complex designs.
- Embedded Memory — Total on-chip RAM capacity of 68,857,856 bits to support large buffering, frame storage, and data-path implementations.
- I/O Count — 342 general-purpose I/O pins for flexible interfacing with external devices and memory.
- Series-Level High-Speed Interfaces — Series features include PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and low-power serial transceivers for high-speed links.
- DSP and Clocking — Variable-precision DSP blocks and fractional synthesis/I/O PLLs (series features) for signal processing and flexible clock management.
- Package and Mounting — 1517-FCBGA (1517-BBGA) surface-mount package, 40×40 ball array for compact board footprint and high I/O density.
- Power Supply — Core voltage supply range of 870 mV to 980 mV to support power-optimized operation.
- Operating Range and Grade — Extended grade device with an operating temperature range of 0 °C to 100 °C.
- Surface Mount Form Factor — FCBGA package intended for modern surface-mount assembly processes.
Typical Applications
- Wireless Infrastructure — Channel and switch card implementations for remote radio heads and mobile backhaul where high logic density and power efficiency are required.
- Wireline Networking — 40G/100G muxponder and transponder line cards, aggregation and line-card functions leveraging the device’s high-speed IP and transceiver capabilities.
- Broadcast and Pro AV — Studio switches and professional audio/video processing where large on-chip memory and DSP resources support real-time media processing.
- Computing and Storage — Server acceleration, flash cache buffering, and cloud compute offload using programmable logic and embedded memory.
- Medical Imaging — Diagnostic imaging and scanner subsystems that benefit from the device’s processing density and on-chip memory for image buffering and real-time processing.
Unique Advantages
- High logic density: 1,150,000 logic elements enable complex, consolidated designs that reduce the need for multiple FPGAs.
- Large on-chip memory: 68,857,856 total RAM bits support extensive buffering and state storage without external memory dependence.
- Rich I/O and interface capability: 342 I/O pins and series-level support for PCIe and 10 Gbps Ethernet simplify integration of high-speed links.
- Compact, production-friendly package: 1517-FCBGA (40×40) surface-mount package balances footprint and thermal characteristics for system-level designs.
- Power-optimized operation: Core voltage range of 870 mV–980 mV combined with the series’ power-efficiency focus helps manage system power consumption.
- Extended temperature range: 0 °C to 100 °C grade for deployments that require extended ambient operating conditions.
Why Choose 10AX115R2F40E1SG?
The 10AX115R2F40E1SG positions itself for mid-range, high-performance, power-sensitive designs that require substantial programmable logic, abundant on-chip memory, and integrated high-speed interface capabilities. Its Arria 10 family heritage provides series-level features—such as variable-precision DSP blocks, advanced clocking, and hardened high-speed IP—that help accelerate development of network, broadcast, compute, and imaging systems.
For engineering teams targeting consolidated hardware architectures with a compact FCBGA footprint, this device delivers the resources and extended-grade operating range to support robust, scalable designs while addressing power and integration constraints.
Request a quote or submit a sales inquiry to discuss availability, pricing, and delivery options for 10AX115R2F40E1SG.

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