10AX115R2F40E1SG

IC FPGA 342 I/O 1517FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 342 68857856 1150000 1517-BBGA, FCBGA

Quantity 877 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FCBGA (40x40)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O342Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs427200Number of Logic Elements/Cells1150000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits68857856

Overview of 10AX115R2F40E1SG – Arria 10 GX FPGA, 1517-FCBGA (40×40)

The 10AX115R2F40E1SG is an Arria 10 GX field programmable gate array (FPGA) device from Intel’s Arria 10 family. It is a 20 nm mid-range FPGA intended for high-performance, power-sensitive applications and SoC designs.

Designed for markets such as wireless, wireline, broadcast, computing and storage, and medical imaging, this device delivers high logic density, substantial on-chip memory, and a compact FCBGA package for board-level integration.

Key Features

  • Programmable Logic Capacity — 1,150,000 logic elements, providing high-density programmable logic for complex designs.
  • Embedded Memory — Total on-chip RAM capacity of 68,857,856 bits to support large buffering, frame storage, and data-path implementations.
  • I/O Count — 342 general-purpose I/O pins for flexible interfacing with external devices and memory.
  • Series-Level High-Speed Interfaces — Series features include PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and low-power serial transceivers for high-speed links.
  • DSP and Clocking — Variable-precision DSP blocks and fractional synthesis/I/O PLLs (series features) for signal processing and flexible clock management.
  • Package and Mounting — 1517-FCBGA (1517-BBGA) surface-mount package, 40×40 ball array for compact board footprint and high I/O density.
  • Power Supply — Core voltage supply range of 870 mV to 980 mV to support power-optimized operation.
  • Operating Range and Grade — Extended grade device with an operating temperature range of 0 °C to 100 °C.
  • Surface Mount Form Factor — FCBGA package intended for modern surface-mount assembly processes.

Typical Applications

  • Wireless Infrastructure — Channel and switch card implementations for remote radio heads and mobile backhaul where high logic density and power efficiency are required.
  • Wireline Networking — 40G/100G muxponder and transponder line cards, aggregation and line-card functions leveraging the device’s high-speed IP and transceiver capabilities.
  • Broadcast and Pro AV — Studio switches and professional audio/video processing where large on-chip memory and DSP resources support real-time media processing.
  • Computing and Storage — Server acceleration, flash cache buffering, and cloud compute offload using programmable logic and embedded memory.
  • Medical Imaging — Diagnostic imaging and scanner subsystems that benefit from the device’s processing density and on-chip memory for image buffering and real-time processing.

Unique Advantages

  • High logic density: 1,150,000 logic elements enable complex, consolidated designs that reduce the need for multiple FPGAs.
  • Large on-chip memory: 68,857,856 total RAM bits support extensive buffering and state storage without external memory dependence.
  • Rich I/O and interface capability: 342 I/O pins and series-level support for PCIe and 10 Gbps Ethernet simplify integration of high-speed links.
  • Compact, production-friendly package: 1517-FCBGA (40×40) surface-mount package balances footprint and thermal characteristics for system-level designs.
  • Power-optimized operation: Core voltage range of 870 mV–980 mV combined with the series’ power-efficiency focus helps manage system power consumption.
  • Extended temperature range: 0 °C to 100 °C grade for deployments that require extended ambient operating conditions.

Why Choose 10AX115R2F40E1SG?

The 10AX115R2F40E1SG positions itself for mid-range, high-performance, power-sensitive designs that require substantial programmable logic, abundant on-chip memory, and integrated high-speed interface capabilities. Its Arria 10 family heritage provides series-level features—such as variable-precision DSP blocks, advanced clocking, and hardened high-speed IP—that help accelerate development of network, broadcast, compute, and imaging systems.

For engineering teams targeting consolidated hardware architectures with a compact FCBGA footprint, this device delivers the resources and extended-grade operating range to support robust, scalable designs while addressing power and integration constraints.

Request a quote or submit a sales inquiry to discuss availability, pricing, and delivery options for 10AX115R2F40E1SG.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up