10AX115R1F40E1SG

IC FPGA 342 I/O 1517FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 342 68857856 1150000 1517-BBGA, FCBGA

Quantity 1,160 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FCBGA (40x40)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O342Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs427200Number of Logic Elements/Cells1150000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits68857856

Overview of 10AX115R1F40E1SG – Arria 10 GX FPGA, 1,150,000 logic elements, 1517-FCBGA

The 10AX115R1F40E1SG is an Intel Arria 10 GX field-programmable gate array (FPGA) supplied in a 1517-FCBGA (40×40) package for surface-mount applications. As part of the Arria 10 device family, it delivers high performance and power efficiency for midrange, power-sensitive designs across multiple markets.

With 1,150,000 logic elements, 68,857,856 total RAM bits and 342 user I/Os, this device targets applications that require large programmable logic capacity, substantial embedded memory, and significant I/O density while operating within an extended-grade temperature range.

Key Features

  • Core logic 1,150,000 logic elements to support large-scale, complex FPGA implementations.
  • Embedded memory 68,857,856 total RAM bits for on-chip buffering, lookup tables and storage.
  • I/O density 342 user I/O pins to interface with high-pin-count peripherals and memory subsystems.
  • Package & mounting 1517-BBGA / 1517-FCBGA (40×40) package in a surface-mount configuration to support compact board layouts.
  • Power supply Operates across a core voltage range of 870 mV to 980 mV for defined power delivery design.
  • Temperature & grade Extended-grade operation from 0 °C to 100 °C for demanding environmental conditions.
  • Arria 10 family capabilities Family-level features described in the device documentation include variable-precision DSP blocks, embedded memory blocks, advanced clock networks and PLLs, PCIe Gen1/2/3 hard IP, low-power serial transceivers, and support for dynamic and partial reconfiguration.
  • Reliability features Documentation for the Arria 10 family references SEU error detection and correction and device errata/design recommendations to support robust system design.

Typical Applications

  • Wireless infrastructure Channel and switch cards in remote radio heads and mobile backhaul systems that require programmable logic and DSP resources.
  • Wireline networking High-speed optical line cards, 40G/100G muxponders and transponders, and aggregation/bridging applications leveraging high I/O and protocol hard IP.
  • Broadcast and media Studio switches, professional audio/video processing and transport systems that use embedded memory and large logic capacity.
  • Computing and storage Server acceleration, flash cache controllers and cloud compute offload where FPGA-based acceleration and memory bandwidth matter.
  • Medical and defense systems Diagnostic imaging, radar, and electronic warfare platforms that benefit from high logic density and family-level reliability features.

Unique Advantages

  • High programmable capacity: 1,150,000 logic elements enable integration of complex algorithms and large RTL designs on a single device, reducing board-level component count.
  • Substantial on‑chip memory: Nearly 69M bits of embedded RAM support buffering, frame storage and lookup-intensive functions without immediate dependence on external memory.
  • Robust I/O capability: 342 I/Os provide flexibility for wide parallel interfaces, high-speed links and multi-channel connectivity.
  • Family-level IP and transceiver support: Arria 10 documentation describes PCIe hard IP, serial transceivers and clocking resources that accelerate time-to-market for common protocols.
  • Extended-grade operation: 0 °C to 100 °C operating range and defined core voltage window (870–980 mV) help simplify thermal and power design for demanding deployments.
  • Surface-mount FCBGA packaging: 1517-FCBGA (40×40) package supports dense PCB integration and is suitable for compact system designs.

Why Choose 10AX115R1F40E1SG?

The 10AX115R1F40E1SG positions itself for midrange, performance- and power-sensitive designs that require substantial logic, embedded memory and I/O resources. As part of the Intel Arria 10 family, it combines documented DSP capabilities, advanced clocking and protocol hard IP that help shorten development cycles for communication, compute and imaging applications.

Choose this device when your design demands large on-chip resources, extensive connectivity and the documented tool and design guidance available for the Arria 10 family to support long-term scalability and system robustness.

Request a quote or submit an inquiry to receive pricing and availability information for the 10AX115R1F40E1SG.

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