10AX115N4F45I3SGES

The 10AX115N4F45I3SGES is an Intel Arria 10 GX series field programmable gate array offered in a 1932-FCBGA (45×45) package. It delivers a high logic capacity device architecture targeted at mid-range, performance- and power-sensitive applications.

With 1,150,000 logic elements, 68,857,856 bits of embedded RAM and 768 general-purpose I/Os, this industrial-grade FPGA is suited for markets such as wireless, wireline, broadcast, computing and storage, and other applications identified for the Arria 10 family.

Key Features

• Core Logic 1,150,000 logic elements provide substantial on-chip programmable logic for complex digital designs.
• Embedded Memory 68,857,856 total RAM bits for large on-chip buffering, caching and state storage.
• I/O Density 768 programmable I/Os to support wide parallel interfaces and multiple external connections.
• Power and Voltage Operating core voltage range of 870 mV to 930 mV to match platform power rails and regulators.
• Package 1932-FCBGA (45×45) ball-grid package for high pin-count, high-density board designs.
• Operating Range Industrial temperature rating from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Family Capabilities (Arria 10) Device-family features include low-power transceivers, variable-precision DSP blocks, rich clocking resources and multiple embedded memory types as described in the Arria 10 device overview.
• RoHS Compliance Device is RoHS compliant.

Typical Applications

• Wireless infrastructure — Channel and switch cards in remote radio heads and mobile backhaul equipment leveraging the Arria 10 family’s performance and power-efficiency profile.
• Wireline networking — Line cards, muxponders/transponders and 40G/100G aggregation modules where high logic density and large on-chip memory are required.
• Broadcast and professional AV — Studio switches, transport and videoconferencing systems that benefit from flexible I/O and substantial programmable logic.
• Computing and storage — Server acceleration, flash cache and cloud compute elements that use on-chip RAM and DSP capabilities for data-path processing.
• Imaging and medical diagnostics — Diagnostic imaging and scanner front-ends requiring high-throughput processing and deterministic I/O.

Unique Advantages

• High logic capacity: 1,150,000 logic elements enable complex, high-parallel designs without immediate need for multi-FPGA partitioning.
• Large on-chip memory: Nearly 69 Mbits of embedded RAM reduces external memory bandwidth dependence and simplifies buffer management.
• Extensive I/O: 768 I/Os accommodate broad external interfacing options for multi-channel and wide-data-path applications.
• Industrial temperature rating: Specified −40 °C to 100 °C supports deployment in industrial and temperature-variable installations.
• Compact high-density package: 1932-FCBGA (45×45) package delivers maximum pin count in a single, compact footprint for dense board implementations.
• Documented device family: The Arria 10 family overview and accompanying documentation provide device-specific guidance on features such as DSP blocks, clocking and transceivers.

Why Choose 10AX115N4F45I3SGES?

The 10AX115N4F45I3SGES positions itself as a high-capacity Arria 10 GX FPGA delivering a balance of logic density, embedded RAM and I/O resources in an industrial-temperature, 1932-FCBGA package. It is intended for mid-range applications that require significant programmable logic, substantial on-chip memory and a large number of external interfaces.

Design teams targeting wireless, wireline, broadcast, computing or imaging systems will find the part’s logic and memory resources and Arria 10 family capabilities suitable for demanding data-path, control and interface functions, supported by Intel’s Arria 10 device documentation and design guidance.

Request a quote or submit an inquiry to evaluate 10AX115N4F45I3SGES for your next design and receive pricing and availability details tailored to your project requirements.