10AX115N4F45I3LG

IC FPGA 768 I/O 1932FCBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 768 68857856 1150000 1932-BBGA, FCBGA

Quantity 1,585 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time9 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FCBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O768Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs427200Number of Logic Elements/Cells1150000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits68857856

Overview of 10AX115N4F45I3LG – Arria 10 GX FPGA, 1932-FCBGA (45×45)

The 10AX115N4F45I3LG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 1932-FCBGA surface-mount package. It delivers high logic density and large on-chip memory to address mid-range, performance-sensitive applications across communications, broadcast, compute, and medical markets.

Built on the Arria 10 device family architecture, this device combines large programmable logic resources with extensive I/O and power-managed operation to support complex system integration in industrial environments.

Key Features

  • High Logic Density  Provides 1,150,000 logic elements for implementing complex digital functions and system-level integration on a single silicon device.
  • Substantial Embedded Memory  Includes 68,857,856 total RAM bits to support large buffering, on-chip data stores, and memory-intensive processing tasks.
  • Extensive I/O  Offers 768 general-purpose I/O pins to interface with high-pin-count peripherals and multiple external memory or transceiver channels.
  • Arria 10 GX Architecture  Part of the Arria 10 family, featuring the architecture and capabilities described for Arria 10 devices, including transceiver and PLL capabilities referenced in the device overview.
  • Power and Supply  Operates from a core voltage supply range of 870 mV to 930 mV, enabling integration with regulated low-voltage power rails.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
  • Package and Mounting  Supplied in a 1932-ball FCBGA (45×45) surface-mount package for compact board-level integration.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • Wireless Infrastructure  Implements channel and switch card logic for remote radio heads and mobile backhaul equipment that require substantial logic and on-chip memory.
  • Wireline Networking  Supports functions in 40G/100G muxponders, transponders, and line cards where high logic density and extensive I/O are needed for packet processing and aggregation.
  • Broadcast and Pro AV  Drives studio switching, videoconferencing, and professional audio/video processing systems that benefit from large embedded memory and flexible I/O.
  • Compute and Storage Acceleration  Serves as a programmable accelerator for server and cloud workloads such as flash cache and server acceleration where on-chip memory and logic resources reduce external bottlenecks.
  • Medical Imaging and Diagnostics  Enables high-throughput signal processing and real-time data handling in diagnostic scanners and imaging systems.

Unique Advantages

  • High logic capacity: 1,150,000 logic elements let you consolidate more functionality onto a single device, reducing board-level complexity.
  • Large on-chip RAM: 68,857,856 total RAM bits support deep buffering and local data processing to lower latency and external memory traffic.
  • Broad I/O connectivity: 768 I/O pins provide flexibility to connect dense peripheral ecosystems and multiple high-speed interfaces.
  • Industrial operating range: −40 °C to 100 °C enables deployment in temperature-demanding industrial installations.
  • Compact FCBGA packaging: The 1932-FCBGA (45×45) package offers a high-pin-count solution in a space-efficient footprint for compact system designs.
  • Standards-conscious supply: RoHS compliance supports environmentally conscious product design and manufacturing.

Why Choose 10AX115N4F45I3LG?

The 10AX115N4F45I3LG positions itself as a high-density, mid-range Arria 10 GX FPGA that balances logic capacity, on-chip memory, and extensive I/O for demanding embedded and networking applications. Its specification set—1,150,000 logic elements, nearly 69 Mb of RAM, 768 I/O, industrial temperature rating, and a compact 1932-FCBGA package—makes it suited to designs that require integration of complex processing, large buffers, and numerous external interfaces.

Engineers designing communications, compute acceleration, broadcast, or imaging systems can leverage this device to reduce component count and consolidate functions while meeting industrial operating requirements and environmental compliance needs.

Request a quote or contact sales to discuss availability, lead times, and pricing for the 10AX115N4F45I3LG.

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