10AX115N4F45E3LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 768 68857856 1150000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 42 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 9 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FCBGA (45x45) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 768 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 427200 | Number of Logic Elements/Cells | 1150000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 68857856 |
Overview of 10AX115N4F45E3LG – Arria 10 GX Field Programmable Gate Array (FPGA) IC, 1932-FCBGA
The 10AX115N4F45E3LG is an Intel Arria 10 GX FPGA in a 1932‑FCBGA (45×45 mm) package. It provides a high‑capacity, mid‑range FPGA architecture with a large logic fabric, substantial embedded RAM, and a high IO count for demanding communications, compute acceleration, and high‑bandwidth interface applications.
Designed for performance and power efficiency within the Arria 10 family, this device targets markets such as wireless and wireline infrastructure, broadcast, computing and storage, medical imaging, and defense communications where complex logic, memory buffering, and extensive I/O are required.
Key Features
- Logic Capacity — 1,150,000 logic elements, enabling large, complex FPGA designs and high integration of custom logic functions.
- Embedded Memory — 68,857,856 total RAM bits for on‑chip buffering, data staging and memory‑intensive algorithms.
- High I/O Count — 768 I/O pins to support multiple high‑speed interfaces and wide parallel buses.
- Package and Mounting — 1932‑FBGA (45×45 mm) FCBGA package, surface mount for dense board integration.
- Power Supply — Low core voltage operation from 870 mV to 930 mV, consistent with modern FPGA core power domains.
- Operating Temperature — Rated for 0 °C to 100 °C operating range; device grade: Extended.
- Arria 10 Family Architecture — Family features include variable‑precision DSP blocks, embedded memory blocks, flexible clock networks and PLLs, and low‑power serial transceivers as described in the Arria 10 device documentation.
- System and Interface IP — Arria 10 device documentation references integrated IP such as PCIe Gen1/2/3 hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and external memory interface support.
- Standards and Compliance — RoHS‑compliant material status.
Typical Applications
- Wireless Infrastructure — Channel processing and switch cards in remote radio heads and mobile backhaul systems where logic density and I/O count enable complex signal processing and interface aggregation.
- Wireline and Optical Networking — 40G/100G muxponder, transponder and line card applications that require large on‑chip memory, high logic capacity and advanced serial transceivers.
- Broadcast and Video — Studio switches, video transport and professional audio/video processing that benefit from embedded RAM and extensive I/O for media streams and buffering.
- Compute and Storage Acceleration — Server offload, flash cache buffering and cloud compute acceleration using dense logic and memory resources to implement custom acceleration kernels.
- Medical and Defense Systems — Diagnostic imaging and secure communications that require complex logic, high memory capacity and flexible I/O configurations.
Unique Advantages
- Large, Integrable Logic Fabric: 1,150,000 logic elements allow consolidation of multiple functions onto a single device, reducing board count and system complexity.
- Significant On‑Chip Memory: Nearly 69 Mb of embedded RAM supports large buffers and state storage for high‑throughput data paths without relying solely on external memory.
- High Port Density: 768 I/Os accommodate numerous parallel interfaces, multi‑lane protocols and wide external buses, simplifying board‑level routing for complex systems.
- Arria 10 System Capabilities: Family‑level features such as DSP blocks, PLLs and hardened interface IP accelerate implementation of signal processing, high‑speed serial links and standard protocols.
- Extended Temperature Range: Rated 0 °C to 100 °C to match deployment environments aligned with the device grade.
- Compact High‑Pin Package: 1932‑FCBGA (45×45 mm) offers high integration density for board designs that require large logic and I/O capacity in a single package.
Why Choose 10AX115N4F45E3LG?
The 10AX115N4F45E3LG combines high logic density, substantial on‑chip RAM and a large I/O complement in an Arria 10 GX platform, making it suitable for mid‑range designs that demand a balance of performance and power efficiency. Its extended grade and RoHS compliance provide predictable operational range and environmental conformity for commercial and communications equipment.
This device is appropriate for engineering teams designing complex signal processing, networking, and acceleration applications that require integrated DSP resources, flexible clocking and hardened interface options documented for the Arria 10 family. Its combination of capacity and system‑level features supports scalable designs and long‑term deployment in targeted markets.
Request a quote or submit a procurement inquiry today to evaluate the 10AX115N4F45E3LG for your next FPGA design.

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