10CL010ZM164I8G

IC FPGA 101 I/O 164MBGA
Part Description

Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC 101 423936 10320 164-TFBGA

Quantity 1,106 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package164-MBGA (8x8)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case164-TFBGANumber of I/O101Voltage1 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs645Number of Logic Elements/Cells10320
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits423936

Overview of 10CL010ZM164I8G – Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC 101 423936 10320 164-TFBGA

The 10CL010ZM164I8G is an Intel Cyclone® 10 LP field programmable gate array (FPGA) supplied in a 164‑TFBGA package. It delivers a balanced combination of programmable logic, on‑chip RAM, and I/O capability in an industrial‑grade device intended for systems that require configurable logic and robust environmental tolerance.

Designed as part of the Cyclone 10 LP family, this device offers a 1.0 V core supply and is specified for an operating temperature range of −40 °C to 100 °C, making it suitable for industrial applications where temperature and reliable operation are important considerations.

Key Features

  • Programmable Logic Capacity — 10,320 logic elements providing flexible implementation of custom digital functions; 645 logic array blocks support structured logic organization.
  • On‑chip Memory — 423,936 total RAM bits for buffering, lookup tables, and small data storage inside the FPGA fabric.
  • I/O Resources — 101 general-purpose I/O pins to interface with sensors, peripherals, and external devices.
  • Power — 1.0 V core voltage (specified as 1 V to 1 V in product data) aligned with the Cyclone 10 LP lower core voltage option.
  • Package and Mounting — 164‑TFBGA package (supplier device package: 164‑MBGA, 8×8) with surface‑mount mounting for compact PCB integration.
  • Industrial Temperature Range — Rated for −40 °C to 100 °C operation to meet demanding environmental requirements.
  • Regulatory Compliance — RoHS compliant for environmental and process compatibility.

Typical Applications

  • Industrial Control — Implement custom control logic and I/O aggregation in systems operating across −40 °C to 100 °C.
  • I/O‑Intensive Interfaces — Use the device’s 101 I/O pins to bridge sensors, actuators, and peripherals with configurable timing and protocol logic.
  • Embedded Programmable Logic — Deploy on compact PCBs where a 164‑TFBGA surface‑mount package and integrated RAM support localized data handling and customization.

Unique Advantages

  • Significant On‑Chip Logic: 10,320 logic elements enable implementation of complex custom logic functions without multiple discrete components.
  • Substantial On‑Chip RAM: 423,936 bits of RAM reduce external memory dependency for buffering and LUT storage.
  • Industrial Reliability: Specified operation from −40 °C to 100 °C supports deployment in harsh temperature environments.
  • Compact BGA Footprint: 164‑TFBGA (164‑MBGA 8×8) package supports high‑density board designs while maintaining surface‑mount assembly compatibility.
  • RoHS Compliant: Meets environmental compliance requirements for modern electronics manufacturing.
  • Generous I/O Count: 101 I/O pins facilitate flexible interfacing for a wide range of peripheral and sensor connections.

Why Choose 10CL010ZM164I8G?

The 10CL010ZM164I8G positions itself as a practical, industrial‑grade FPGA option within the Cyclone 10 LP family, offering a clear balance of logic density, on‑chip RAM, and a robust I/O complement in a compact 164‑TFBGA package. Its 1.0 V core supply and specified −40 °C to 100 °C operating range make it appropriate for embedded and industrial systems that need configurable hardware with dependable thermal tolerance.

Engineers selecting this device benefit from integrated resources that reduce external component count and simplify board-level integration while maintaining the flexibility of programmable logic. The combination of logic elements, RAM capacity, and I/O density supports a wide range of custom digital tasks in industrial and embedded designs.

Request a quote or submit an inquiry to receive pricing and availability information for the 10CL010ZM164I8G and to discuss how it can fit into your next programmable‑logic design.

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