10CL016YE144C8G

IC FPGA 78 I/O 144EQFP
Part Description

Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC 78 516096 15408 144-LQFP Exposed Pad

Quantity 1,187 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package144-EQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFP Exposed PadNumber of I/O78Voltage1.2 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs963Number of Logic Elements/Cells15408
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits516096

Overview of 10CL016YE144C8G – Cyclone® 10 LP FPGA, 144-LQFP Exposed Pad

The 10CL016YE144C8G is an Intel Cyclone® 10 LP field-programmable gate array (FPGA) in a 144-LQFP exposed pad surface-mount package. It provides programmable logic capacity and on-chip memory suitable for compact commercial embedded designs.

Key on-chip resources include 15,408 logic elements, 516,096 bits of RAM, and 78 I/O pins, with a 1.2 V core supply and a commercial operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

  • Logic Capacity — 15,408 logic elements for implementing custom digital logic and state machines.
  • On-chip Memory — 516,096 total RAM bits to support buffering, FIFOs, and local data storage without external RAM.
  • I/O Density — 78 I/O pins to connect peripherals, sensors, and buses within compact systems.
  • Package and Mounting — 144-LQFP exposed pad (supplier package: 144-EQFP 20×20) in a surface-mount form factor for PCB integration and thermal conduction.
  • Power — 1.2 V core supply specified for the device.
  • Commercial Grade and Temperature — Rated for commercial use with an operating temperature range of 0 °C to 85 °C.
  • Regulatory — RoHS compliant.

Typical Applications

  • Custom digital control — Implement control logic, finite-state machines, and glue logic using the available logic elements and I/Os.
  • Embedded data buffering — Use the on-chip 516,096 bits of RAM for temporary storage, FIFOs, or packet buffering.
  • Peripheral aggregation — Integrate multiple sensor or interface signals through the device’s 78 I/O pins for compact system designs.

Unique Advantages

  • Balanced logic and memory — 15,408 logic elements paired with over half a million bits of RAM provides a practical balance for many mid-range programmable designs.
  • Compact package — 144-LQFP exposed pad offers a small footprint with improved thermal path for surface-mount applications.
  • Commercial temperature rating — Specified 0 °C to 85 °C operation aligns with a wide range of commercial electronic products.
  • Reasonable I/O count — 78 I/Os enable interfacing to multiple peripherals and buses without external I/O expanders.
  • RoHS compliance — Meets lead-free and restricted-substance requirements for modern electronic assemblies.

Why Choose 10CL016YE144C8G?

The 10CL016YE144C8G delivers a practical combination of programmable logic, on-chip RAM, and I/O in a compact 144-LQFP exposed pad package, making it well suited for commercial embedded designs that require moderate logic capacity and local memory. Its 1.2 V core supply and 0 °C to 85 °C operating range align with many commercial product requirements, while RoHS compliance supports contemporary manufacturing standards.

This part is a fit for engineers and procurement teams seeking a Cyclone® 10 LP device with clear, verifiable resource counts—logic elements, RAM bits, and I/O—packaged for surface-mount assembly and thermal management via an exposed pad.

Request a quote or submit a parts inquiry to obtain pricing, lead times, and availability for 10CL016YE144C8G.

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