10CL016YF484I7G
| Part Description |
Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC 340 516096 15408 484-BGA |
|---|---|
| Quantity | 190 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 340 | Voltage | 1.2 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 963 | Number of Logic Elements/Cells | 15408 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 516096 |
Overview of 10CL016YF484I7G – Cyclone® 10 LP FPGA, 15,408 Logic Elements, 484-BGA
The 10CL016YF484I7G is an Intel Cyclone® 10 LP field programmable gate array (FPGA) offered in a 484-ball BGA package. It provides a balance of on-chip logic, RAM and I/O density suitable for demanding industrial embedded designs that require reconfigurable digital logic and high pin count integration.
With 15,408 logic elements, 516,096 bits of on-chip RAM and 340 user I/Os, this device targets applications that need substantial programmable logic, flexible interfacing and a 1.2 V core supply for standard Cyclone 10 LP operation.
Key Features
- Core / Architecture Cyclone 10 LP FPGA architecture with a 1.2 V core supply (specified as 1.2 V to 1.2 V) to support standard core operation.
- Logic Capacity 15,408 logic elements and 963 logic blocks provide programmable fabric for combinational and sequential logic implementations.
- On‑chip Memory 516,096 total RAM bits for implementing FIFOs, buffers, small data stores and state machines without external memory.
- I/O 340 user I/O pins to support dense peripheral and interface connectivity directly from the FPGA package.
- Package & Mounting 484-ball FBGA (23 × 23) package in a surface-mount format for PCB assembly and compact system integration.
- Temperature & Grade Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for a wide range of industrial environments.
- Compliance RoHS compliant, supporting regulatory requirements for lead-free assembly processes.
Typical Applications
- Industrial Control Implement motor control logic, protocol bridging and deterministic I/O handling using the device’s logic capacity and high I/O count.
- Data Acquisition & Signal Processing Use on-chip RAM and programmable logic to buffer, pre-process and route sensor or instrumentation data in real time.
- Interface Bridging Consolidate multiple serial/parallel interfaces or implement custom buses leveraging 340 I/Os for direct connectivity.
- Embedded System Glue Logic Replace large discrete logic BOMs with a single programmable device to simplify board design and improve integration.
Unique Advantages
- Substantial Logic Density: 15,408 logic elements enable mid-size FPGA designs without moving to larger device families.
- Generous On‑Chip RAM: 516,096 bits of RAM reduce dependency on external memory for many buffering and local storage needs.
- High I/O Count: 340 I/Os allow direct connection to numerous peripherals, sensors and external devices, minimizing external interface components.
- Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in industrial environments with wider temperature ranges.
- Compact BGA Packaging: 484-FBGA (23×23) provides a high-pin-count solution in a compact, surface-mount form factor for space-constrained boards.
- RoHS Compliant: Facilitates lead-free manufacturing and regulatory compliance for modern assemblies.
Why Choose 10CL016YF484I7G?
The 10CL016YF484I7G Cyclone 10 LP FPGA combines mid-range programmable logic capacity with substantial on-chip RAM and a high I/O count in a compact 484‑BGA package. Its industrial temperature rating and RoHS compliance make it a practical choice for embedded and industrial designs that require reliable, reconfigurable digital logic and flexible interfacing.
This device is suited for engineers and system designers looking to consolidate logic, implement custom interfaces or accelerate time-to-market with a reprogrammable platform that balances capacity, I/O and package density.
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