10CL016YF484C6G

The 10CL016YF484C6G is a commercial-grade Cyclone® 10 LP Field Programmable Gate Array (FPGA) from Intel. This device combines 15,408 logic elements with 516,096 bits of on-chip RAM and 340 user I/Os to deliver a compact, integrated programmable-logic solution.

Designed for commercial embedded systems, the device uses a 1.2 V core supply and is supplied in a surface-mount 484-BGA package (supplier package: 484-FBGA, 23×23). Operating range is 0 °C to 85 °C and the device is RoHS compliant.

Key Features

• Core Logic — 15,408 logic elements provide the programmable fabric to implement custom logic, glue functions, and on-chip accelerators.
• On-chip Memory — 516,096 total RAM bits for buffering, FIFOs, and small data stores supporting a range of stateful logic implementations.
• I/O Density — 340 I/Os for extensive external interfacing and flexible connectivity to peripherals and sensors.
• Power — Single core voltage at 1.2 V as specified for the device.
• Package & Mounting — Surface-mount 484-BGA package; supplier package 484-FBGA (23×23) enables a compact PCB footprint.
• Commercial Grade & Temperature Range — Rated for commercial operation from 0 °C to 85 °C.
• Compliance — RoHS compliant.

Typical Applications

• Commercial Embedded Systems — Implement custom control logic and peripheral interfacing using the device’s logic density and I/O count within commercial-temperature designs.
• High‑Density I/O Control — Use the 340 I/Os to aggregate, route, and manage signals between boards, sensors, and actuators.
• On‑Chip Data Buffering — Leverage 516,096 RAM bits for buffering, small packet queues, and intermediate data storage in real-time processing tasks.
• Glue Logic and Protocol Bridging — Implement protocol conversion and timing adaptation between subsystems using the programmable fabric.

Unique Advantages

• High logical density: 15,408 logic elements enable complex combinational and sequential logic implementations without external ASICs.
• Substantial on‑chip RAM: 516,096 bits of RAM reduce reliance on external memory for many buffering and state-storage needs.
• Large I/O complement: 340 I/Os provide flexibility to connect multiple peripherals and interfaces directly to the FPGA.
• Compact surface-mount package: 484-BGA (484-FBGA, 23×23) minimizes PCB area while supporting high pin count.
• Commercial operational profile: Rated for 0 °C to 85 °C to meet typical commercial-environment requirements.
• Environmental compliance: RoHS-compliant construction supports regulatory and manufacturing requirements.

Why Choose 10CL016YF484C6G?

The 10CL016YF484C6G delivers a balanced combination of logic capacity, on-chip memory, and high I/O count in a compact 484-BGA package for commercial-grade designs. It is part of the Intel Cyclone® 10 LP family and is documented in the Cyclone 10 LP device datasheet, providing the electrical and timing specifications needed for integration into embedded systems.

This device is suited to design teams that need a programmable, high-density logic solution with ample RAM and I/O resources while maintaining a commercial operating temperature range and RoHS compliance.

Request a quote or submit a procurement inquiry to obtain pricing and availability for the 10CL016YF484C6G.