10CL016YF484C8G
| Part Description |
Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC 340 516096 15408 484-BGA |
|---|---|
| Quantity | 1,386 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 340 | Voltage | 1.2 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 963 | Number of Logic Elements/Cells | 15408 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 516096 |
Overview of 10CL016YF484C8G – Cyclone® 10 LP FPGA, 484‑BGA, 15,408 logic elements
The 10CL016YF484C8G is an Intel Cyclone® 10 LP Field Programmable Gate Array (FPGA) in a 484‑BGA package designed for commercial‑grade applications. It provides a balance of programmable logic, embedded RAM, and I/O density for custom digital logic, interface bridging, and system integration tasks where low core voltage and compact packaging are important.
Built on the Cyclone® 10 LP family architecture, this device offers a defined set of resources including 15,408 logic elements and 516,096 bits of on‑chip RAM, supporting designs that require moderate logic capacity and significant on‑chip memory in a surface‑mount BGA footprint.
Key Features
- Programmable Logic 15,408 logic elements provide the core configurable fabric for implementing custom digital functions and parallel datapaths.
- Embedded RAM 516,096 total RAM bits enable on‑chip buffering, FIFOs, and small lookup tables for control and dataplane functions.
- I/O Density 340 I/O pins support a wide range of external interfaces and parallel connections in compact systems.
- Package 484‑BGA (484‑FBGA, 23 × 23) surface‑mount package delivers a high‑density ball grid array suitable for space‑constrained PCBs.
- Power Standard core voltage option at 1.2 V for the device core supply.
- Commercial Grade Temperature Rated for 0 °C to 85 °C operating temperature to match commercial application requirements.
- RoHS Compliant Manufactured in compliance with RoHS environmental requirements.
Typical Applications
- Embedded Control and Glue Logic Implement custom control state machines, protocol adaptation, and interface bridging using the device’s programmable logic and abundant I/O.
- Data Buffering and Packet Handling On‑chip RAM supports buffering, FIFOs, and packet staging for mid‑range data path tasks.
- Development and Prototyping Compact package and balanced resource set make this device suitable for development boards and prototype systems where a commercial‑grade FPGA is required.
Unique Advantages
- Balanced Logic and Memory: 15,408 logic elements coupled with 516,096 bits of RAM give designers the flexibility to implement both control logic and substantial on‑chip data storage without external memory.
- High I/O Count: 340 I/O pins enable multiple peripheral interfaces and parallel connections, reducing the need for external I/O expanders.
- Compact, High‑Density Package: The 484‑FBGA (23 × 23) package allows a high pin count in a small PCB footprint, aiding miniaturized designs.
- Low‑Voltage Core: 1.2 V core operation aligns with common low‑voltage system rails for power‑sensitive designs.
- Commercial Temperature Range: Specified 0 °C to 85 °C operation suits mainstream consumer and industrial‑adjacent applications that use commercial‑grade components.
- RoHS Compliance: Meets environmental regulatory requirements for lead‑free assembly.
Why Choose 10CL016YF484C8G?
The 10CL016YF484C8G positions itself as a flexible, commercial‑grade FPGA choice for designers who need a balanced combination of logic density, on‑chip RAM, and a high I/O count in a compact BGA package. Its 1.2 V core and RoHS compliance make it suitable for modern low‑voltage, environmentally compliant designs.
This device is well suited to engineering teams creating mid‑complexity custom logic, interface bridges, or prototype systems that require on‑chip memory and abundant I/O without moving to larger, higher‑cost FPGA families. Its specification set supports scalable designs that can leverage the Cyclone® 10 LP device family for consistent integration and support.
If you would like a price quote or additional procurement information for the 10CL016YF484C8G, submit a request for a quote or contact sales to discuss availability and ordering details.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018