10CL016YM164C6G

The 10CL016YM164C6G is a Cyclone® 10 LP field programmable gate array (FPGA) offered in a compact 164‑TFBGA surface‑mount package. It combines a sizable programmable fabric with on‑chip RAM and flexible I/O to address commercial applications that require configurable logic, data buffering, and interface customization.

Designed for commercial‑grade deployments, this device provides a defined core supply of 1.2 V, an operating temperature range of 0 °C to 85 °C, and RoHS compliance for streamlined integration into production designs.

Key Features

• Programmable Logic — 15,408 logic elements for implementing custom logic, state machines, and glue‑logic functions.
• Logic Structure — 963 logic blocks to organize and scale design implementation across the device fabric.
• On‑Chip Memory — 516,096 total RAM bits available for buffering, FIFOs, and local data storage.
• I/O Resources — 87 general I/O pins to support external interface connectivity and signal routing.
• Power — Standard core voltage of 1.2 V to match common low‑voltage FPGA power architectures.
• Package and Mounting — 164‑TFBGA package (supplier device package: 164‑MBGA 8×8) in a surface‑mount form factor for compact board layouts.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for commercial application environments.
• Environmental Compliance — RoHS compliant for regulatory and manufacturing compatibility.

Typical Applications

• Commercial Embedded Systems — Use the FPGA to implement custom control logic, protocol handling, and feature upgrades in commercial electronics.
• Custom I/O and Interface Bridging — Leverage 87 I/O pins to create tailored interface bridges or glue logic between peripherals and host processors.
• Data Buffering and Sequencing — On‑chip RAM (516,096 bits) supports buffering, packet staging, and deterministic sequencing in data paths.

Unique Advantages

• Balanced Logic and Memory: 15,408 logic elements coupled with 516,096 RAM bits allow concurrent implementation of control logic and local data storage without external memory for many designs.
• Compact, Assembly‑Friendly Package: 164‑TFBGA surface‑mount package (164‑MBGA 8×8) enables high‑density board placement while supporting automated assembly.
• Clear Power Envelope: Single core supply at 1.2 V simplifies power rail requirements and integration with common 1.2 V supplies.
• Commercial Temperature Rating: Specified 0 °C to 85 °C operation for reliable deployment in commercial environments.
• Regulatory Readiness: RoHS compliance helps meet common environmental and manufacturing standards.

Why Choose 10CL016YM164C6G?

The 10CL016YM164C6G provides a practical combination of programmable logic density, on‑chip RAM, and flexible I/O in a compact 164‑TFBGA package tailored for commercial applications. Its defined 1.2 V core supply and 0 °C to 85 °C operating range make it suitable for production designs that need deterministic, reprogrammable logic without introducing undue power or thermal complexity.

This device is a fit for engineering teams seeking a commercially rated FPGA with measurable logic capacity (15,408 logic elements), substantial embedded RAM (516,096 bits), and sufficient I/O (87 pins) to implement interface logic, buffering, and custom control functions within a compact board footprint.

Request a quote or submit procurement details to receive pricing and availability for the 10CL016YM164C6G. Our team will respond with a tailored quote and order support.