10CL016YE144A7G

The Intel 10CL016YE144A7G is a Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC offered in a 144-LQFP exposed-pad package. It provides on-chip programmable logic with 15,408 logic elements, 963 LABs/CLBs, 516,096 total RAM bits and 78 user I/O pins.

Designed and qualified for automotive use (AEC-Q100), this device supports operation from –40 °C to 125 °C with a 1.2 V core supply. Its combination of mid-range logic, embedded RAM, and a compact surface-mount package targets embedded and automotive system designs that require programmable logic in a packaged form factor.

Key Features

• Core Logic  Provides 15,408 logic elements (963 LABs/CLBs), enabling partitioned and custom logic implementations within a Cyclone 10 LP architecture.
• Memory  Includes 516,096 total RAM bits for on-chip buffering, small data tables, and local storage.
• I/O  78 user I/O pins support a variety of external interfaces and signal connections in a single device footprint.
• Power  Standard core voltage of 1.2 V as specified for the device, providing clear power-supply requirements for system integration.
• Package & Mounting  144-LQFP exposed pad (supplier device package: 144-EQFP, 20×20) in a surface-mount form factor for PCB assembly and thermal management.
• Temperature Range  Rated for operation from –40 °C to 125 °C to meet demanding ambient conditions.
• Automotive Qualification  AEC-Q100 qualification is specified for this device, supporting automotive-grade design requirements.
• Compliance  RoHS compliant, aligned with common environmental and manufacturing requirements.

Typical Applications

• Automotive control modules  AEC-Q100 qualification and a –40 °C to 125 °C operating range make this FPGA suitable for in-vehicle control, domain controllers, and sensor interfacing tasks where programmable logic is needed.
• Embedded signal interfacing  78 I/O and on-chip RAM enable protocol adaptation, I/O aggregation, and custom interfacing between sensors, actuators, and processors.
• Compact system integration  The 144-LQFP exposed-pad package delivers a balance of pin count and thermal handling for space-constrained PCBs requiring surface-mount assembly.
• Local data buffering and preprocessing  Over 500k bits of embedded RAM supports local buffering, small FIFOs, and temporary data storage for edge processing tasks.

Unique Advantages

• Automotive-ready qualification: AEC-Q100 qualification and extended operating temperature support system designs that must meet automotive reliability standards.
• Mid-range logic and memory density: 15,408 logic elements paired with 516,096 RAM bits provide a practical balance for medium-complexity functions without external memory.
• Generous I/O count in a compact package: 78 user I/O pins in a 144-LQFP exposed-pad package enable flexible connectivity while fitting constrained board layouts.
• Clear power requirements: A defined 1.2 V core supply simplifies power-supply design and system integration.
• Surface-mount package with exposed pad: The exposed pad supports PCB-level thermal dissipation and mechanical stability for automotive and embedded assemblies.
• RoHS compliant: Meets common environmental directives for lead-free manufacturing processes.

Why Choose 10CL016YE144A7G?

The 10CL016YE144A7G positions itself as a Cyclone® 10 LP FPGA option for designs that require a mid-range mix of programmable logic, embedded RAM, and flexible I/O in a surface-mount LQFP package. Its AEC-Q100 qualification and –40 °C to 125 °C operating range make it appropriate for automotive and other temperature-challenging embedded applications.

Backed by Intel’s Cyclone 10 LP device family documentation, this device is suited for engineers and procurement focused on scalable, qualified programmable logic solutions that fit compact board footprints and have well-defined electrical and thermal characteristics.

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