10CL055YU484C8G

IC FPGA 321 I/O 484UBGA
Part Description

Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC 321 2396160 55856 484-BGA

Quantity 1,817 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O321Voltage1.2 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3491Number of Logic Elements/Cells55856
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2396160

Overview of 10CL055YU484C8G – Cyclone® 10 LP FPGA, 484-BGA

The 10CL055YU484C8G is an Intel Cyclone® 10 LP field-programmable gate array supplied in a 484-ball BGA (23×23) surface-mount package. It is a commercial-grade FPGA featuring a 1.2 V core supply and the Cyclone 10 LP device architecture.

Designed for commercial embedded designs that require a combination of configurable logic, on-chip RAM, and extensive I/O, this device offers 55,856 logic elements and 2,396,160 bits of embedded RAM, plus 321 I/O pins in a compact footprint.

Key Features

  • Logic Capacity — 55,856 logic elements provide substantial programmable logic resources for combinational and sequential logic implementation.
  • On-chip Memory — 2,396,160 total RAM bits for data buffering, FIFOs, and local storage within programmable logic.
  • I/O Density — 321 I/O pins to support multiple external interfaces and parallel signal paths.
  • Core Voltage — Standard 1.2 V core supply, matching the Cyclone 10 LP standard core voltage option.
  • Package & Mounting — 484-FBGA (23×23) package, surface-mount mounting type for compact board-level integration.
  • Commercial Grade — Rated for commercial operating conditions with an operating temperature range of 0 °C to 85 °C.
  • RoHS Compliant — Conforms to RoHS requirements for environmental compliance.

Typical Applications

  • Commercial embedded systems — Programmable logic for control, protocol bridging, and custom logic functions in commercial electronics.
  • I/O-dense interface designs — High pin count supports designs requiring multiple parallel or serial interfaces and external peripherals.
  • On-chip memory–dependent logic — Substantial embedded RAM capacity for buffering, packet processing, and local data storage.
  • Compact board-level FPGA implementations — 484-BGA package enables dense PCB layouts while providing ample I/O and logic resources.

Unique Advantages

  • Substantial logic density: 55,856 logic elements allow implementation of complex logic functions without immediate need for larger devices.
  • Significant on-chip RAM: 2,396,160 bits of RAM reduce external memory dependence for many data-path and buffering tasks.
  • High I/O count: 321 I/Os provide flexibility to connect multiple interfaces and peripherals directly to the FPGA.
  • Compact, manufacturable package: 484-FBGA (23×23) surface-mount package supports high-density board designs and automated assembly.
  • Commercial operating range: Rated 0 °C to 85 °C for systems targeted at commercial-grade deployments.
  • Regulatory-friendly: RoHS compliance supports lead-free manufacturing requirements.

Why Choose 10CL055YU484C8G?

The 10CL055YU484C8G positions itself as a commercially graded Cyclone 10 LP FPGA balancing a high count of logic elements and substantial on-chip RAM with a large I/O complement in a compact 484-BGA package. It is suitable for designers who need programmable logic capacity, integrated RAM, and extensive external connectivity while maintaining a commercial temperature profile and RoHS compliance.

This device is well suited for development and production of compact, I/O-rich FPGA solutions where board-level density and programmable resources are primary considerations. Its specification set enables scalable designs that leverage the Cyclone 10 LP architecture and Intel's device documentation for implementation and validation.

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