10CL055YU484I7G

IC FPGA 321 I/O 484UBGA
Part Description

Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC 321 2396160 55856 484-FBGA

Quantity 520 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-UBGA (19x19)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-FBGANumber of I/O321Voltage1.2 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3491Number of Logic Elements/Cells55856
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2396160

Overview of 10CL055YU484I7G – Cyclone® 10 LP FPGA, 55,856 logic elements, 321 I/O, 484‑FBGA

The 10CL055YU484I7G is an Intel Cyclone® 10 LP field programmable gate array (FPGA) supplied in a 484‑FBGA package. It provides a balance of programmable logic, embedded RAM, and high I/O count tailored for industrial embedded applications that require flexible, reconfigurable hardware.

Key value comes from a substantial logic capacity and on‑chip RAM combined with an industrial operating temperature range and a compact surface‑mount package, enabling dense I/O and memory‑centric designs in constrained footprints.

Key Features

  • Core logic — 55,856 logic elements (cells) for implementing custom digital functions and state machines.
  • Embedded memory — 2,396,160 total RAM bits for buffering, FIFOs, and on‑chip data storage.
  • I/O density — 321 user I/O pins to support parallel interfaces, sensors, and peripheral connectivity.
  • Package and mounting — 484‑FBGA (supplier package: 484‑UBGA 19×19) in a surface‑mount form factor for compact board integration.
  • Power — Core supply at 1.2 V, matching the Cyclone 10 LP standard core voltage option for this device.
  • Industrial temperature grade — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
  • RoHS compliant — Meets RoHS requirements for lead‑free assemblies and regulatory compliance.

Typical Applications

  • Industrial automation — Implement motor control logic, protocol bridging, and I/O aggregation using the device’s logic density and 321 I/O pins.
  • Embedded control systems — Use on‑chip RAM and programmable logic to accelerate deterministic control tasks and custom state machines.
  • Communications and I/O subsystems — Deploy as a protocol adapter or traffic manager where high I/O count and on‑chip memory are required.

Unique Advantages

  • High integration density: 55,856 logic elements and 2,396,160 RAM bits enable complex logic and significant on‑chip buffering without external memory.
  • Large I/O capacity: 321 I/O pins provide flexible connectivity for sensors, peripherals, and multi‑lane interfaces.
  • Industrial readiness: −40 °C to 100 °C operating range supports deployment in demanding ambient conditions.
  • Compact surface‑mount packaging: 484‑FBGA (19×19 UBGA) allows high pin count in a space‑efficient footprint for dense PCBs.
  • Regulatory compliance: RoHS compliance supports lead‑free assembly processes.

Why Choose 10CL055YU484I7G?

The 10CL055YU484I7G delivers a substantial mix of logic, memory, and I/O in a compact 484‑FBGA package targeted at industrial embedded designs. Its combination of 55,856 logic elements, 2.4 Mbit of on‑chip RAM, and 321 I/Os makes it well suited for applications that require configurable hardware acceleration, deterministic control, and dense peripheral interfacing.

Designed for engineers and OEMs building robust, reconfigurable systems, this Cyclone® 10 LP device provides scalability and integration that simplify board design and reduce bill‑of‑materials for medium‑to‑high complexity FPGA applications.

Request a quote or submit an inquiry to receive pricing and availability for the 10CL055YU484I7G and to discuss how it fits your next industrial FPGA design.

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