10CL055YF484I7G

IC FPGA 321 I/O 484FBGA
Part Description

Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC 321 2396160 55856 484-BGA

Quantity 1,572 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BGANumber of I/O321Voltage1.2 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3491Number of Logic Elements/Cells55856
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2396160

Overview of 10CL055YF484I7G – Cyclone® 10 LP FPGA, 484-BGA, Industrial

The 10CL055YF484I7G is an Intel Cyclone® 10 LP field-programmable gate array (FPGA) in a 484-ball BGA package. It delivers a balanced combination of logic capacity, on-chip RAM, and I/O count for embedded and industrial designs.

Key attributes include 55,856 logic elements, 2,396,160 bits of total RAM, 321 I/O pins, a 1.2 V core supply, RoHS compliance, and an industrial operating temperature range of –40 °C to 100 °C.

Key Features

  • Core and Logic — 55,856 logic elements provide substantial programmable fabric for custom logic, control, and data-path implementations.
  • On-chip Memory — 2,396,160 total RAM bits support buffering, FIFOs, and embedded data storage for high-throughput designs.
  • I/O Density — 321 user I/O pins enable extensive peripheral interfacing and multi-channel connectivity.
  • Power — Designed for a 1.2 V core supply, matching standard Cyclone® 10 LP core voltage options for system-level power planning.
  • Package & Mounting — 484-FBGA (23×23) package, surface-mount mounting type, suitable for compact PCB layouts.
  • Temperature & Grade — Industrial grade with an operating temperature range of –40 °C to 100 °C for reliable performance in demanding environments.
  • Environmental Compliance — RoHS compliant for regulatory and manufacturing requirements.

Typical Applications

  • Industrial Control — Industrial temperature rating and extensive I/O make this device suitable for sensor interfacing, motor control logic, and PLC-related custom functions.
  • Embedded Systems — High logic element count and on-chip RAM support custom acceleration, protocol bridging, and control-plane functions in embedded platforms.
  • Communications & I/O Aggregation — Large I/O count and programmable fabric enable multi-channel interface consolidation and protocol adaptation tasks.

Unique Advantages

  • High Logic Density: 55,856 logic elements enable complex custom logic and parallel processing implementations without external ASIC development.
  • Substantial On-Chip RAM: 2,396,160 bits of RAM reduce reliance on external memory for buffering and real-time data handling.
  • Extensive I/O Count: 321 I/O pins simplify board-level routing for multi-sensor or multi-peripheral designs, reducing the need for external multiplexers.
  • Industrial Temperature Range: Rated from –40 °C to 100 °C to maintain operation across a wide range of field conditions.
  • Compact FBGA Package: 484-ball FBGA (23×23) provides a dense footprint for space-constrained PCBs while maintaining high pin count.
  • Regulatory Ready: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose 10CL055YF484I7G?

The 10CL055YF484I7G delivers a practical blend of logic capacity, embedded memory, and I/O resources in a compact 484-FBGA package with industrial-grade temperature tolerance. It is suited to engineers who need a programmable, RoHS-compliant FPGA platform capable of implementing complex control, interface, and data-processing functions without moving to custom silicon.

For designs that require scalability and reliability, this Cyclone® 10 LP device provides verifiable on-chip resources and a clear set of electrical and environmental specifications to streamline system-level integration and long-term deployment.

Request a quote or submit an inquiry to discuss availability, pricing, and fit for your next design.

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