10CL040ZU484I8G

The 10CL040ZU484I8G is an Intel Cyclone® 10 LP field‑programmable gate array (FPGA) in a 484‑FBGA package configured for industrial applications. It provides 39,600 logic elements, 1,161,216 total RAM bits and up to 325 I/O, delivering a compact, programmable fabric for designs that require on‑board logic, embedded memory and substantial I/O density.

This device uses the Cyclone 10 LP architecture with a 1.0 V core option (the "Z" core voltage variant for the –I8 speed grade) and is specified for surface‑mount assembly and industrial operating temperatures from –40 °C to 100 °C.

Key Features

• Core Logic — 39,600 logic elements providing programmable logic capacity for mid‑range FPGA designs.
• On‑chip Memory — 1,161,216 total RAM bits available for data buffering, FIFOs and local storage within the FPGA fabric.
• I/O Density — Up to 325 I/O pins to connect sensors, actuators, buses and peripherals without additional multiplexing.
• Power and Voltage — 1.0 V core supply (lower core voltage "Z" option for –I8 speed grade) for the device core as specified in the Cyclone 10 LP device documentation.
• Package — 484‑FBGA (supplier package: 484‑UBGA, 19 × 19 mm) in a surface‑mount form factor suited for compact, high‑density PCB designs.
• Industrial Temperature Range — Specified operating temperature from –40 °C to 100 °C for industrial deployment scenarios.
• Compliance — RoHS‑compliant material status for regulatory and manufacturing alignment.

Typical Applications

• Industrial Control and Automation — Industrial temperature rating and robust I/O count support sensor aggregation, real‑time control logic and interface bridging in factory and process automation.
• Embedded Processing and Glue Logic — On‑chip RAM and abundant logic elements enable protocol translation, peripheral control and customized state machines.
• High‑density I/O Systems — Up to 325 I/O pins accommodate multi‑channel interfaces, bus expansion and direct connectivity to external components.

Unique Advantages

• Significant Logic Capacity: 39,600 logic elements provide substantial programmable resources for mid‑range FPGA implementations without stepping up to larger package families.
• Generous Embedded Memory: Over 1.16 Mbit of on‑chip RAM reduces dependence on external memory for buffering and temporary data storage.
• High I/O Count: 325 I/O pins simplify board routing and reduce the need for external I/O expanders in complex systems.
• Industrial‑grade Thermal Range: –40 °C to 100 °C operating temperature supports deployment in demanding environmental conditions.
• Compact, High‑density Package: 484‑FBGA (19 × 19 UBGA) offers a small footprint for space‑constrained PCBs while maintaining high pin count.
• RoHS Compliant: Material compliance supports modern manufacturing and environmental requirements.

Why Choose 10CL040ZU484I8G?

The 10CL040ZU484I8G blends the Cyclone 10 LP FPGA architecture with a lower‑voltage core option and an industrial temperature specification to deliver a programmable platform suited for industrial and embedded applications. Its combination of 39,600 logic elements, sizeable on‑chip RAM and 325 I/O pins makes it a practical choice for designs that require mid‑level logic density, flexible interfacing and robust thermal performance.

Engineers and procurement teams seeking a surface‑mount, RoHS‑compliant FPGA in a 484‑FBGA package will find this device suitable for compact boards that demand high I/O density and reliable operation across an extended temperature range.

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