10CL040YU484I7G
| Part Description |
Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC 325 1161216 39600 484-FBGA |
|---|---|
| Quantity | 909 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-UBGA (19x19) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-FBGA | Number of I/O | 325 | Voltage | 1.2 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2475 | Number of Logic Elements/Cells | 39600 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1161216 |
Overview of 10CL040YU484I7G – Cyclone® 10 LP FPGA, 39,600 logic elements, 484‑FBGA
The 10CL040YU484I7G is an Intel Cyclone® 10 LP field programmable gate array supplied in a 484‑FBGA (484‑UBGA, 19×19) package. It delivers a balanced combination of programmable logic, on‑chip RAM, and high I/O density for industrial applications that require a robust programmable fabric.
Key hardware characteristics include 39,600 logic elements, 1,161,216 bits of embedded RAM, 325 I/O pins, a 1.2 V core supply, and an industrial operating temperature range of −40 °C to 100 °C.
Key Features
- Logic Capacity 39,600 logic elements provide a mid‑range programmable fabric suitable for a wide range of logic‑intensive tasks.
- Logic Array Blocks 2,475 LABs (logic array blocks) supporting structured implementation of logic and control functions.
- On‑Chip Memory 1,161,216 bits of total RAM allow for local buffering, state machines, and small data storage without external memory.
- I/O Density 325 I/O pins enable extensive peripheral and sensor interfacing directly from the FPGA package.
- Power Designed for a 1.2 V core supply, simplifying power rail design for systems targeting this core voltage.
- Package & Mounting 484‑FBGA / 484‑UBGA (19×19) surface‑mount package for compact board integration with high pin count.
- Temperature Range Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
- Regulatory Compliance RoHS compliant to support environmentally conscious manufacturing requirements.
Typical Applications
- Industrial Control Programmable logic and wide operating temperature make this device suitable for control systems and automation equipment used in industrial environments.
- Embedded Systems On‑chip RAM and substantial logic capacity enable implementation of custom datapaths, protocol handling, and glue logic in embedded products.
- I/O‑Rich Interfaces High I/O count supports dense peripheral interfacing, sensor aggregation, and multi‑bus bridging applications.
Unique Advantages
- Substantial Logic Resources: 39,600 logic elements and 2,475 LABs let you implement sizeable custom logic without immediate need for higher‑end devices.
- Significant On‑Chip RAM: 1,161,216 bits of RAM reduce dependence on external memory for many control and buffering tasks.
- High I/O Count: 325 I/O pins provide flexibility to connect multiple peripherals, buses, and sensors directly to the FPGA.
- Industrial Temperature Rating: −40 °C to 100 °C operation supports deployments in demanding thermal environments.
- Compact, High‑Pin Package: 484‑FBGA (19×19 UBGA) package enables high density board layouts while retaining extensive I/O.
- RoHS Compliance: Environmentally compliant manufacturing and end‑product compatibility.
Why Choose 10CL040YU484I7G?
The 10CL040YU484I7G positions itself as a practical, industrial‑grade Cyclone® 10 LP FPGA option for designs that need moderate to high logic capacity, significant embedded RAM, and abundant I/O in a compact FBGA package. Its 1.2 V core supply and −40 °C to 100 °C operating range make it suitable for embedded and industrial applications where temperature resilience and integration density matter.
This device is a fit for engineering teams seeking a balanced FPGA solution that combines programmable logic, on‑chip memory, and high I/O without moving to larger, more complex device families. The 484‑FBGA package supports dense board integration while maintaining the pin count required for complex interfacing.
Request a quote or submit an inquiry for 10CL040YU484I7G to get pricing and availability information tailored to your project requirements.

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