10CL040YU484I7G

IC FPGA 325 I/O 484UBGA
Part Description

Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC 325 1161216 39600 484-FBGA

Quantity 909 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-UBGA (19x19)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-FBGANumber of I/O325Voltage1.2 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2475Number of Logic Elements/Cells39600
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1161216

Overview of 10CL040YU484I7G – Cyclone® 10 LP FPGA, 39,600 logic elements, 484‑FBGA

The 10CL040YU484I7G is an Intel Cyclone® 10 LP field programmable gate array supplied in a 484‑FBGA (484‑UBGA, 19×19) package. It delivers a balanced combination of programmable logic, on‑chip RAM, and high I/O density for industrial applications that require a robust programmable fabric.

Key hardware characteristics include 39,600 logic elements, 1,161,216 bits of embedded RAM, 325 I/O pins, a 1.2 V core supply, and an industrial operating temperature range of −40 °C to 100 °C.

Key Features

  • Logic Capacity  39,600 logic elements provide a mid‑range programmable fabric suitable for a wide range of logic‑intensive tasks.
  • Logic Array Blocks  2,475 LABs (logic array blocks) supporting structured implementation of logic and control functions.
  • On‑Chip Memory  1,161,216 bits of total RAM allow for local buffering, state machines, and small data storage without external memory.
  • I/O Density  325 I/O pins enable extensive peripheral and sensor interfacing directly from the FPGA package.
  • Power  Designed for a 1.2 V core supply, simplifying power rail design for systems targeting this core voltage.
  • Package & Mounting  484‑FBGA / 484‑UBGA (19×19) surface‑mount package for compact board integration with high pin count.
  • Temperature Range  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
  • Regulatory Compliance  RoHS compliant to support environmentally conscious manufacturing requirements.

Typical Applications

  • Industrial Control  Programmable logic and wide operating temperature make this device suitable for control systems and automation equipment used in industrial environments.
  • Embedded Systems  On‑chip RAM and substantial logic capacity enable implementation of custom datapaths, protocol handling, and glue logic in embedded products.
  • I/O‑Rich Interfaces  High I/O count supports dense peripheral interfacing, sensor aggregation, and multi‑bus bridging applications.

Unique Advantages

  • Substantial Logic Resources: 39,600 logic elements and 2,475 LABs let you implement sizeable custom logic without immediate need for higher‑end devices.
  • Significant On‑Chip RAM: 1,161,216 bits of RAM reduce dependence on external memory for many control and buffering tasks.
  • High I/O Count: 325 I/O pins provide flexibility to connect multiple peripherals, buses, and sensors directly to the FPGA.
  • Industrial Temperature Rating: −40 °C to 100 °C operation supports deployments in demanding thermal environments.
  • Compact, High‑Pin Package: 484‑FBGA (19×19 UBGA) package enables high density board layouts while retaining extensive I/O.
  • RoHS Compliance: Environmentally compliant manufacturing and end‑product compatibility.

Why Choose 10CL040YU484I7G?

The 10CL040YU484I7G positions itself as a practical, industrial‑grade Cyclone® 10 LP FPGA option for designs that need moderate to high logic capacity, significant embedded RAM, and abundant I/O in a compact FBGA package. Its 1.2 V core supply and −40 °C to 100 °C operating range make it suitable for embedded and industrial applications where temperature resilience and integration density matter.

This device is a fit for engineering teams seeking a balanced FPGA solution that combines programmable logic, on‑chip memory, and high I/O without moving to larger, more complex device families. The 484‑FBGA package supports dense board integration while maintaining the pin count required for complex interfacing.

Request a quote or submit an inquiry for 10CL040YU484I7G to get pricing and availability information tailored to your project requirements.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up