10CL040YU484A7G
| Part Description |
Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC 325 1161216 39600 484-FBGA |
|---|---|
| Quantity | 291 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-UBGA (19x19) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-FBGA | Number of I/O | 325 | Voltage | 1.2 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | N/A | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2475 | Number of Logic Elements/Cells | 39600 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 1161216 |
Overview of 10CL040YU484A7G – Cyclone® 10 LP FPGA, 39,600 logic elements, 1.2 V, 484‑FBGA
The 10CL040YU484A7G is an Intel Cyclone® 10 LP field programmable gate array (FPGA) in a 484‑FBGA package. It provides 39,600 logic elements and 1,161,216 bits of embedded RAM with up to 325 I/Os, delivered in a surface‑mount 484‑UBGA (19×19) footprint.
Designed and qualified for automotive use with AEC‑Q100 qualification and an operating range from −40 °C to 125 °C, this device is intended for applications that require hardened qualification, robust I/O capacity, and a compact BGA package.
Key Features
- Core Logic — 39,600 logic elements provide substantial programmable logic capacity for custom digital functions and application‑specific implementations.
- LABs — 2,475 LABs (logic array blocks) offering organized logic resources for efficient design partitioning.
- On‑Chip Memory — 1,161,216 total RAM bits for data buffering, state storage, and temporary on‑chip memory needs.
- I/O Density — 325 programmable I/O pins to support multiple interfaces, sensor inputs, and peripheral connectivity.
- Power — Core supply specified at 1.2 V, matching the device’s standard core voltage requirement.
- Package & Mounting — 484‑FBGA package, supplier device package 484‑UBGA (19×19); surface‑mount for compact board integration.
- Automotive Qualification — Grade: Automotive with AEC‑Q100 qualification for applications that require established automotive device qualification.
- Operating Temperature — −40 °C to 125 °C to support wide temperature operation in demanding environments.
- Environmental Compliance — RoHS compliant.
Typical Applications
- Automotive embedded systems — Suited to vehicle electronics designs that require AEC‑Q100 qualification and extended temperature operation.
- High‑I/O control and interfacing — Supports applications needing extensive I/O counts and flexible logic for custom protocol bridging or signal conditioning.
- On‑board processing and buffering — Large on‑chip RAM (1,161,216 bits) and 39,600 logic elements accommodate buffering, preprocessing, and real‑time logic tasks.
Unique Advantages
- Automotive‑grade reliability: AEC‑Q100 qualification and −40 °C to 125 °C operating range help meet automotive program requirements.
- High logic density in a compact BGA: 39,600 logic elements in a 484‑FBGA (19×19) package reduce board area while providing significant logic resources.
- Extensive I/O capability: 325 I/Os enable integration of multiple sensors, actuators, and peripheral interfaces without added glue logic.
- Substantial on‑chip RAM: 1,161,216 bits of RAM support buffering and data‑intensive tasks directly on the FPGA fabric.
- Industry‑standard mounting and compliance: Surface‑mount 484‑UBGA packaging with RoHS compliance simplifies manufacturing and environmental compliance.
Why Choose 10CL040YU484A7G?
The 10CL040YU484A7G positions itself as a robust, automotive‑qualified Cyclone® 10 LP FPGA option when designers need a balance of logic capacity, on‑chip RAM, and high I/O density in a compact BGA package. Its AEC‑Q100 qualification and wide operating temperature range make it suitable for designs that require proven qualification and reliable operation across harsh environments.
This device is ideal for teams building embedded systems that require flexible programmable logic, substantial local memory, and many I/Os, while maintaining a compact board footprint and established automotive device qualification.
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