10CL040ZF484I8G

IC FPGA 325 I/O 484FBGA
Part Description

Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC 325 1161216 39600 484-BGA

Quantity 1,161 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BGANumber of I/O325Voltage1 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2475Number of Logic Elements/Cells39600
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1161216

Overview of 10CL040ZF484I8G – Cyclone® 10 LP FPGA, 484-FBGA, 39,600 logic elements

The Intel Cyclone® 10 LP 10CL040ZF484I8G is a field-programmable gate array (FPGA) device in a 484-ball fine-pitch BGA package. It delivers a medium-density programmable logic resource with on-chip RAM and a substantial I/O count, specified for industrial-grade temperature ranges.

This device is targeted at designs that require configurable digital logic, significant embedded RAM, and a dense I/O complement in a compact surface-mount package. Its 1.0 V core supply option and industrial operating range support deployment in temperature-challenged environments.

Key Features

  • Logic Capacity  39,600 logic elements provide the programmable logic resources for implementing custom digital functions and control logic.
  • Embedded Memory  1,161,216 total RAM bits of on-chip memory for data buffering, state storage, and small LUT-based memory structures.
  • I/O Density  325 I/O pins to interface with peripherals, sensors, and external memory or control nets.
  • Core Voltage  Specified 1.0 V core supply, consistent with the Cyclone 10 LP lower-voltage option.
  • Industrial Temperature  Operating temperature range from –40 °C to 100 °C for industrial-grade deployments.
  • Package & Mounting  484-FBGA (23 × 23) package, surface-mount mounting type, offering a compact footprint for board-level integration.
  • RoHS Compliance  RoHS compliant to meet current environmental requirements.

Unique Advantages

  • High-density programmable logic: 39,600 logic elements enable medium-complexity designs without external ASICs.
  • Substantial on-chip RAM: Over 1.16 million bits of RAM reduce the need for external memory in many buffering and temporary storage use cases.
  • Rich I/O complement: 325 I/Os provide flexibility for interfacing to multiple peripherals and parallel buses.
  • Industrial temperature support: Specified –40 °C to 100 °C operation for deployments that require extended temperature tolerance.
  • Compact BGA package: 484-FBGA (23 × 23) balances PCB area and pin count for dense designs.
  • Environmentally compliant: RoHS status indicates alignment with lead-free and restricted substance requirements.

Why Choose 10CL040ZF484I8G?

The 10CL040ZF484I8G combines a balanced mix of programmable logic capacity, embedded RAM, and a high I/O count in a compact 484-FBGA surface-mount package, all rated for industrial temperature operation. As a member of the Intel Cyclone® 10 LP family, it provides designers a documented device option with a 1.0 V core supply for lower-voltage implementations.

This part is well suited for projects requiring medium-density FPGA resources and reliable operation across industrial temperature ranges, where board space and I/O flexibility are important design drivers.

Request a quote or submit an inquiry for pricing and availability for the 10CL040ZF484I8G.

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