10CL055YF484C6G

IC FPGA 321 I/O 484FBGA
Part Description

Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC 321 2396160 55856 484-BGA

Quantity 166 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O321Voltage1.2 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3491Number of Logic Elements/Cells55856
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2396160

Overview of 10CL055YF484C6G – Cyclone® 10 LP FPGA, 55,856 logic elements, 484‑BGA

The 10CL055YF484C6G is an Intel Cyclone® 10 LP field programmable gate array (FPGA) offered in a commercial-grade package. It delivers 55,856 logic elements and 2,396,160 bits of on-chip RAM in a compact 484‑FBGA (23×23) surface-mount package.

Designed for commercial embedded systems, this device provides a high I/O count and standard 1.2 V core supply to support dense digital logic implementations and flexible I/O integration within a 0 °C to 85 °C operating range.

Key Features

  • Logic Capacity 55,856 logic elements to implement complex custom logic, state machines, and datapaths.
  • On‑Chip Memory 2,396,160 total RAM bits for buffering, FIFOs, and embedded data storage.
  • I/O Density 321 user I/O pins to interface with peripherals, sensors, and high-pin-count connectors.
  • Power Standard core voltage operation at 1.2 V for the device core.
  • Package and Mounting 484‑FBGA (23×23) package in a surface-mount format for compact board-level integration.
  • Commercial Grade Rated for commercial operating temperatures from 0 °C to 85 °C.
  • Environmental Compliance RoHS compliant.

Typical Applications

  • Commercial Embedded Systems High logic density and on‑chip RAM support custom digital processing and control functions in commercial electronic products.
  • Interface Aggregation Large I/O count enables protocol bridging and peripheral aggregation on a single device.
  • Custom Logic Acceleration Use the device to offload and accelerate application-specific datapaths and state machines within a system.

Unique Advantages

  • High Logic Density: 55,856 logic elements provide ample resources to implement complex designs without multiple components.
  • Significant On‑Chip RAM: 2,396,160 bits of RAM reduce external memory dependence and simplify board design.
  • Generous I/O Count: 321 I/Os allow direct connection to many peripherals, minimizing the need for external multiplexing.
  • Compact Surface‑Mount Package: 484‑FBGA (23×23) enables dense PCB layouts while maintaining manufacturability.
  • Commercial Operating Range: Rated 0 °C to 85 °C for deployment in standard commercial electronics applications.
  • RoHS Compliant: Meets environmental compliance requirements for modern electronics production.

Why Choose 10CL055YF484C6G?

The 10CL055YF484C6G combines substantial logic capacity, on‑chip RAM, and high I/O density in a compact 484‑FBGA footprint, making it well suited for commercial embedded designs that require integrated digital processing and flexible peripheral connectivity. Its 1.2 V core supply and RoHS compliance align with common commercial power and environmental requirements.

This part is a practical choice for engineers implementing medium-to-high complexity logic functions, protocol bridging, or custom acceleration where a single, integrated FPGA can reduce BOM and simplify board design while operating across standard commercial temperature ranges.

Request a quote or submit an inquiry to receive pricing and availability information for the 10CL055YF484C6G.

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