10CL055YF484C6G
| Part Description |
Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC 321 2396160 55856 484-BGA |
|---|---|
| Quantity | 166 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 321 | Voltage | 1.2 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3491 | Number of Logic Elements/Cells | 55856 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2396160 |
Overview of 10CL055YF484C6G – Cyclone® 10 LP FPGA, 55,856 logic elements, 484‑BGA
The 10CL055YF484C6G is an Intel Cyclone® 10 LP field programmable gate array (FPGA) offered in a commercial-grade package. It delivers 55,856 logic elements and 2,396,160 bits of on-chip RAM in a compact 484‑FBGA (23×23) surface-mount package.
Designed for commercial embedded systems, this device provides a high I/O count and standard 1.2 V core supply to support dense digital logic implementations and flexible I/O integration within a 0 °C to 85 °C operating range.
Key Features
- Logic Capacity 55,856 logic elements to implement complex custom logic, state machines, and datapaths.
- On‑Chip Memory 2,396,160 total RAM bits for buffering, FIFOs, and embedded data storage.
- I/O Density 321 user I/O pins to interface with peripherals, sensors, and high-pin-count connectors.
- Power Standard core voltage operation at 1.2 V for the device core.
- Package and Mounting 484‑FBGA (23×23) package in a surface-mount format for compact board-level integration.
- Commercial Grade Rated for commercial operating temperatures from 0 °C to 85 °C.
- Environmental Compliance RoHS compliant.
Typical Applications
- Commercial Embedded Systems High logic density and on‑chip RAM support custom digital processing and control functions in commercial electronic products.
- Interface Aggregation Large I/O count enables protocol bridging and peripheral aggregation on a single device.
- Custom Logic Acceleration Use the device to offload and accelerate application-specific datapaths and state machines within a system.
Unique Advantages
- High Logic Density: 55,856 logic elements provide ample resources to implement complex designs without multiple components.
- Significant On‑Chip RAM: 2,396,160 bits of RAM reduce external memory dependence and simplify board design.
- Generous I/O Count: 321 I/Os allow direct connection to many peripherals, minimizing the need for external multiplexing.
- Compact Surface‑Mount Package: 484‑FBGA (23×23) enables dense PCB layouts while maintaining manufacturability.
- Commercial Operating Range: Rated 0 °C to 85 °C for deployment in standard commercial electronics applications.
- RoHS Compliant: Meets environmental compliance requirements for modern electronics production.
Why Choose 10CL055YF484C6G?
The 10CL055YF484C6G combines substantial logic capacity, on‑chip RAM, and high I/O density in a compact 484‑FBGA footprint, making it well suited for commercial embedded designs that require integrated digital processing and flexible peripheral connectivity. Its 1.2 V core supply and RoHS compliance align with common commercial power and environmental requirements.
This part is a practical choice for engineers implementing medium-to-high complexity logic functions, protocol bridging, or custom acceleration where a single, integrated FPGA can reduce BOM and simplify board design while operating across standard commercial temperature ranges.
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