10CL025ZU256I8G
| Part Description |
Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC 150 608256 24624 256-LFBGA |
|---|---|
| Quantity | 63 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-UBGA (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 150 | Voltage | 1 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1539 | Number of Logic Elements/Cells | 24624 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 608256 |
Overview of 10CL025ZU256I8G – Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC 150 608256 24624 256-LFBGA
The 10CL025ZU256I8G is an Intel Cyclone® 10 LP FPGA offered in an industrial-grade configuration. It provides programmable logic with 24,624 logic elements and 1539 logic blocks, combined with on-chip RAM totaling 608,256 bits, making it suitable for embedded designs that require moderate logic capacity and integrated memory.
This device is supplied with a 1.0 V core option, supports up to 150 I/O pins, and is delivered in a 256-ball LFBGA surface-mount package (256-UBGA, 14×14). It is RoHS compliant and rated for operation from –40 °C to 100 °C.
Key Features
- Logic Density – 24,624 logic elements and 1,539 logic blocks provide configurable logic resources for mid-range FPGA designs.
- On‑Chip Memory – 608,256 total RAM bits for implementing buffers, FIFOs, and small on-chip memory structures.
- I/O Capacity – Up to 150 I/O pins to interface with peripherals, sensors, and external devices.
- Core Voltage – 1.0 V core supply (lower core voltage option, Z variant) as specified for this part number.
- Package & Mounting – 256-LFBGA (supplier package: 256-UBGA, 14×14) optimized for surface-mount assembly in compact board layouts.
- Temperature Range – Industrial operating range from –40 °C to 100 °C for deployments in temperature-challenging environments.
- Regulatory – RoHS compliant.
Typical Applications
- Industrial embedded systems – Programmable logic for control, data aggregation, and protocol handling in industrial hardware requiring an industrial temperature rating.
- Communication interfaces – Mid-density FPGA resources and 150 I/O pins for implementing custom interface logic and bridging functions.
- Compact system integration – Surface-mount 256-LFBGA package suited for space-constrained PCB designs that need integrated logic and memory.
Unique Advantages
- Balanced logic and memory – 24,624 logic elements paired with 608,256 bits of RAM allow combined control and buffering functions on a single device.
- Industrial temperature capability – Rated from –40 °C to 100 °C for applications where extended ambient ranges are required.
- Low-voltage core option – 1.0 V core supply supports designs targeting lower-power core operation (part-specific variant).
- High I/O count – 150 available I/O pins enable broad peripheral connectivity without additional interface chips.
- Compact BGA footprint – 256-ball LFBGA (14×14) for high-density PCB integration while keeping board area minimized.
- RoHS compliant – Conforms to RoHS requirements for lead-free assembly and regulatory compatibility.
Why Choose 10CL025ZU256I8G?
The 10CL025ZU256I8G positions itself as an industrial-grade Cyclone® 10 LP FPGA that combines mid-range logic capacity and substantial on-chip RAM with a compact BGA package and 150 I/Os. Its 1.0 V core option and –40 °C to 100 °C operating range make it a practical choice for embedded designs that require programmable logic, moderate memory, and robust thermal tolerance.
This part is suited to engineering teams looking for a verified industrial FPGA building block that integrates logic, RAM, and flexible I/O in a surface-mount 256-ball package while maintaining RoHS compliance.
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