10CL025YU256C6G

IC FPGA 150 I/O 256UBGA
Part Description

Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC 150 608256 24624 256-LFBGA

Quantity 1,072 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package256-UBGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGANumber of I/O150Voltage1.2 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1539Number of Logic Elements/Cells24624
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits608256

Overview of 10CL025YU256C6G – Cyclone® 10 LP FPGA, 24,624 Logic Elements, 150 I/Os

The 10CL025YU256C6G is an Intel Cyclone® 10 LP field programmable gate array (FPGA) supplied in a 256-LFBGA package. It provides a balance of programmable logic, on-chip RAM, and I/O capacity for commercial-grade digital designs.

Key device attributes include 24,624 logic elements, 608,256 total RAM bits, 150 I/Os, a 1.2 V core supply, and a commercial operating temperature range of 0 °C to 85 °C—making it suitable for applications that require reconfigurable logic with defined commercial operating limits.

Key Features

  • Logic Capacity  24,624 logic elements enable moderate-complexity custom logic implementations and system-level integration.
  • On-chip Memory  608,256 total RAM bits for data buffering, state storage, and local memory requirements.
  • I/O Resources  150 I/O pins to support a wide range of peripheral connectivity and parallel interfaces.
  • Core Power  Operates at a 1.2 V core supply as specified in the product data.
  • Package and Mounting  256-LFBGA (256-UBGA, 14×14) surface-mount package for compact board integration.
  • Grade and Temperature Range  Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Regulatory Compliance  RoHS compliant for materials and manufacturing compliance.

Typical Applications

  • Commercial digital systems  Used where reconfigurable logic and moderate I/O density are required within commercial temperature limits (0 °C to 85 °C).
  • Board-level integration  Compact 256-LFBGA package supports dense PCB designs that require on-chip RAM and programmable logic capacity.
  • Connectivity and interfacing  150 I/Os enable implementation of parallel interfaces, peripheral bridging, and system glue logic.

Unique Advantages

  • High logic density: 24,624 logic elements provide ample resources for moderate-complexity designs without external logic devices.
  • Significant on-chip RAM: 608,256 total RAM bits reduce reliance on external memory for buffering and state retention.
  • Flexible I/O count: 150 I/Os accommodate multiple interfaces and peripherals in a single device footprint.
  • Compact, surface-mount package: 256-LFBGA (14×14) package enables space-efficient board layouts.
  • Commercial-grade operation: Rated for 0 °C to 85 °C, matching typical commercial system requirements.
  • RoHS compliance: Compliant materials support regulatory requirements for many global markets.

Why Choose 10CL025YU256C6G?

The 10CL025YU256C6G delivers a balanced combination of logic capacity, on-chip memory, and I/O resources in a compact 256-LFBGA surface-mount package. Its 1.2 V core supply and commercial operating temperature rating make it a clear option for designers targeting commercial-grade, reconfigurable digital systems that need significant local memory and I/O density.

This device is well suited to engineering teams and procurement groups looking for an Intel Cyclone® 10 LP FPGA with defined electrical and thermal characteristics—providing a scalable logic platform while maintaining compliance with RoHS requirements.

Request a quote or submit an inquiry to purchase the 10CL025YU256C6G and receive pricing and availability details for your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up