10CL025YE144C6G
| Part Description |
Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC 76 608256 24624 144-LQFP Exposed Pad |
|---|---|
| Quantity | 909 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-EQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP Exposed Pad | Number of I/O | 76 | Voltage | 1.2 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1539 | Number of Logic Elements/Cells | 24624 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 608256 |
Overview of 10CL025YE144C6G – Cyclone® 10 LP FPGA, 24,624 logic elements, 76 I/O, 144-LQFP
The 10CL025YE144C6G is an Intel Cyclone® 10 LP field-programmable gate array (FPGA) in a 144-pin LQFP exposed-pad package. It delivers a mid-range programmable logic resource set for commercial embedded and electronic designs that require flexible I/O, on-chip RAM, and compact surface-mount packaging.
This device is optimized for applications that need 24,624 logic elements, substantial block RAM (608,256 bits), and a 76-pin I/O footprint while operating within a 1.2 V core supply and a commercial 0 °C to 85 °C temperature range.
Key Features
- Logic Capacity — 24,624 logic elements and 1,539 logic array blocks (LABs) provide a programmable fabric for custom digital designs and moderate-complexity functions.
- On‑Chip Memory — 608,256 total RAM bits for buffering, FIFOs, and data-path storage directly on the FPGA fabric.
- I/O Resources — 76 general-purpose I/O pins to interface with external devices, sensors, and peripherals.
- Power — Core voltage specified at 1.2 V, enabling designs targeting the Cyclone 10 LP standard core supply.
- Package & Mounting — 144-LQFP with exposed pad (supplier device package: 144-EQFP, 20×20 mm); surface-mount mounting for compact PCB integration and thermal conduction through the exposed pad.
- Operating Range — Commercial grade with an operating temperature from 0 °C to 85 °C, suitable for mainstream electronics applications.
- Compliance — RoHS compliant for environmentally conscious designs and supply-chain compatibility.
Typical Applications
- Consumer Electronics — Implement custom control logic, interface glue, and peripheral aggregation using the FPGA’s logic and I/O resources.
- Communications Endpoints — Handle protocol bridging, packet buffering, and low-to-moderate throughput data-path functions using internal RAM and programmable logic.
- Edge Processing & Prototyping — Rapidly prototype application-specific hardware accelerators and offload deterministic tasks from a microcontroller or processor.
Unique Advantages
- Substantial Logic in a Compact Package: 24,624 logic elements in a 144‑pin LQFP enables significant functional density without a large-footprint package.
- Large On‑Chip RAM: 608,256 bits of RAM support buffering and data-path operations inside the FPGA, reducing external memory dependence.
- Flexible I/O Count: 76 I/O pins provide multiple external interface options for sensors, peripherals, and board-level connectivity.
- Surface‑Mount Integration with Exposed Pad: 144‑LQFP exposed pad simplifies PCB assembly and thermal coupling for typical commercial designs.
- Commercial Temperature Fit: Rated 0 °C to 85 °C to meet the environmental needs of mainstream electronic products.
- RoHS Compliant: Aligns with common environmental and manufacturing requirements.
Why Choose 10CL025YE144C6G?
The 10CL025YE144C6G positions itself as a commercially graded Cyclone 10 LP FPGA that balances programmable logic capacity, on-chip RAM, and a mid-size I/O count in a compact 144‑LQFP exposed-pad package. Its 1.2 V core supply and industry-standard surface-mount package make it suitable for embedded designs where board space, thermal conduction through an exposed pad, and RoHS compliance matter.
This device is well suited for design teams and OEMs building consumer and communications endpoint products that require configurable logic resources, internal memory for data buffering, and flexible interfacing without moving to larger package formats.
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