10CL016ZU484I8G

IC FPGA 340 I/O 484UBGA
Part Description

Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC 340 516096 15408 484-BGA

Quantity 1,404 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BGANumber of I/O340Voltage1 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs963Number of Logic Elements/Cells15408
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits516096

Overview of 10CL016ZU484I8G – Cyclone® 10 LP FPGA, 15,408 logic elements, 516,096 RAM bits, 340 I/O, 484-BGA

The 10CL016ZU484I8G is an Intel Cyclone® 10 LP Field Programmable Gate Array (FPGA) supplied in a 484-BGA package. It delivers 15,408 logic elements, 516,096 bits of on-chip RAM, and up to 340 general-purpose I/O pins in a surface-mount 484-FBGA (23×23) package.

Targeted at industrial applications, this device is specified for a 1.0 V core supply and an operating temperature range of −40 °C to 100 °C, providing a compact, I/O-dense programmable logic solution for designs that require moderate logic capacity, substantial on-chip memory, and broad I/O integration.

Key Features

  • Logic Capacity — 15,408 logic elements to implement custom digital functions and moderate-complexity designs.
  • On‑Chip Memory — 516,096 total RAM bits for buffering, state storage, and embedded memory needs without external RAM.
  • I/O Density — 340 I/O pins to support wide peripheral connectivity and multi‑channel interfaces.
  • Core Voltage — Configured for the lower core voltage option “Z” (1.0 V), aligned with the –I8 speed grade per Intel naming.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for use in industrial environments.
  • Package and Mounting — 484-FBGA (23×23) surface-mount package, providing a compact footprint for high-density board designs.
  • Regulatory Compliance — RoHS compliant.

Typical Applications

  • Industrial Control and Automation — FPGA-based control logic, sensor aggregation, and deterministic I/O handling within industrial temperature environments.
  • I/O-Intensive Embedded Systems — Systems requiring a large number of GPIOs or multi-channel interfaces can leverage the device’s 340 I/O pins.
  • On-Board Memory and Buffering — Designs that require significant on-chip memory for packet buffering, data queues, or state machines can use the 516,096 RAM bits.
  • Compact, High-Density Boards — The 484-FBGA (23×23) surface-mount package fits space-constrained PCBs while providing extensive I/O and logic resources.

Unique Advantages

  • Balanced Logic and Memory — 15,408 logic elements paired with 516,096 RAM bits enable a mix of compute and data-storage functions on a single device, reducing external component count.
  • High I/O Count — 340 I/O pins simplify integration with multiple peripherals and parallel interfaces without complex multiplexing.
  • Industrial Temperature Rating — Specified operation from −40 °C to 100 °C supports deployment in demanding industrial settings.
  • Low-Voltage Core Option — The 1.0 V core voltage (“Z” option) supports designs constrained by core power budgets while matching the –I8 speed-grade configuration described by Intel.
  • Compact BGA Packaging — 484-FBGA (23×23) enables a high-density mounting solution for modern PCB layouts.
  • RoHS Compliant — Conforms to RoHS requirements for environmentally conscious design and manufacturing.

Why Choose 10CL016ZU484I8G?

The 10CL016ZU484I8G positions itself as a practical Cyclone® 10 LP FPGA option for engineers who need substantial logic resources, significant on-chip RAM, and high I/O capacity in an industrial-grade, surface-mount BGA package. Its 1.0 V core option and −40 °C to 100 °C rating make it suitable for applications where power-conscious core operation and extended temperature range are required.

This device is well suited to teams building mid-complexity programmable logic solutions that benefit from integrated memory and dense I/O, and for projects that demand a compact package with established manufacturer support and RoHS compliance.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the 10CL016ZU484I8G.

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