10CL016ZU484I8G
| Part Description |
Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC 340 516096 15408 484-BGA |
|---|---|
| Quantity | 1,404 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 340 | Voltage | 1 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 963 | Number of Logic Elements/Cells | 15408 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 516096 |
Overview of 10CL016ZU484I8G – Cyclone® 10 LP FPGA, 15,408 logic elements, 516,096 RAM bits, 340 I/O, 484-BGA
The 10CL016ZU484I8G is an Intel Cyclone® 10 LP Field Programmable Gate Array (FPGA) supplied in a 484-BGA package. It delivers 15,408 logic elements, 516,096 bits of on-chip RAM, and up to 340 general-purpose I/O pins in a surface-mount 484-FBGA (23×23) package.
Targeted at industrial applications, this device is specified for a 1.0 V core supply and an operating temperature range of −40 °C to 100 °C, providing a compact, I/O-dense programmable logic solution for designs that require moderate logic capacity, substantial on-chip memory, and broad I/O integration.
Key Features
- Logic Capacity — 15,408 logic elements to implement custom digital functions and moderate-complexity designs.
- On‑Chip Memory — 516,096 total RAM bits for buffering, state storage, and embedded memory needs without external RAM.
- I/O Density — 340 I/O pins to support wide peripheral connectivity and multi‑channel interfaces.
- Core Voltage — Configured for the lower core voltage option “Z” (1.0 V), aligned with the –I8 speed grade per Intel naming.
- Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for use in industrial environments.
- Package and Mounting — 484-FBGA (23×23) surface-mount package, providing a compact footprint for high-density board designs.
- Regulatory Compliance — RoHS compliant.
Typical Applications
- Industrial Control and Automation — FPGA-based control logic, sensor aggregation, and deterministic I/O handling within industrial temperature environments.
- I/O-Intensive Embedded Systems — Systems requiring a large number of GPIOs or multi-channel interfaces can leverage the device’s 340 I/O pins.
- On-Board Memory and Buffering — Designs that require significant on-chip memory for packet buffering, data queues, or state machines can use the 516,096 RAM bits.
- Compact, High-Density Boards — The 484-FBGA (23×23) surface-mount package fits space-constrained PCBs while providing extensive I/O and logic resources.
Unique Advantages
- Balanced Logic and Memory — 15,408 logic elements paired with 516,096 RAM bits enable a mix of compute and data-storage functions on a single device, reducing external component count.
- High I/O Count — 340 I/O pins simplify integration with multiple peripherals and parallel interfaces without complex multiplexing.
- Industrial Temperature Rating — Specified operation from −40 °C to 100 °C supports deployment in demanding industrial settings.
- Low-Voltage Core Option — The 1.0 V core voltage (“Z” option) supports designs constrained by core power budgets while matching the –I8 speed-grade configuration described by Intel.
- Compact BGA Packaging — 484-FBGA (23×23) enables a high-density mounting solution for modern PCB layouts.
- RoHS Compliant — Conforms to RoHS requirements for environmentally conscious design and manufacturing.
Why Choose 10CL016ZU484I8G?
The 10CL016ZU484I8G positions itself as a practical Cyclone® 10 LP FPGA option for engineers who need substantial logic resources, significant on-chip RAM, and high I/O capacity in an industrial-grade, surface-mount BGA package. Its 1.0 V core option and −40 °C to 100 °C rating make it suitable for applications where power-conscious core operation and extended temperature range are required.
This device is well suited to teams building mid-complexity programmable logic solutions that benefit from integrated memory and dense I/O, and for projects that demand a compact package with established manufacturer support and RoHS compliance.
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