10CL016ZF484I8G

The 10CL016ZF484I8G is a Cyclone® 10 LP FPGA in a 484-ball BGA package designed for industrial-grade embedded systems. It integrates 15,408 logic elements with on-chip memory and a high I/O count to support dense, configurable logic and interface functions.

Delivered with a 1.0 V core option and industrial operating range, this device targets applications that require a balance of integration, I/O density, and operation across elevated temperature ranges.

Key Features

• Core logic – 15,408 logic elements provide a substantial fabric for implementing custom digital logic, finite-state machines, and glue logic.
• On-chip memory – 516,096 total RAM bits for distributed and block memory requirements within FPGA designs.
• I/O capacity – 340 I/O pins to support multiple interfaces, parallel buses, and extensive peripheral connectivity.
• Power – 1.0 V core supply (Z core voltage option) matching the device identification for low-voltage operation.
• Package and mounting – 484-ball BGA (484-FBGA, 23 × 23) in a surface-mount configuration for compact, board-level integration.
• Temperature and grade – Industrial grade with an operating temperature range of –40 °C to 100 °C for deployment in demanding environments.
• Environmental compliance – RoHS compliant.

Typical Applications

• Industrial automation and controls – Industrial-grade temperature range and configurable logic make the device suitable for control-oriented, embedded FPGA tasks.
• High-density interface bridging – 340 I/Os enable complex protocol translation and multi-interface aggregation on a single device.
• Embedded signal processing and glue logic – A combination of 15,408 logic elements and 516,096 RAM bits supports custom processing pipelines and local buffering.

Unique Advantages

• Low-voltage core operation: The 1.0 V core option reduces core power requirements and aligns with systems designed for lower supply rails.
• High I/O density: 340 I/O pins let designers consolidate multiple external interfaces without additional interface ICs.
• Substantial on-chip memory: Over 500k bits of RAM enables local data buffering and state storage to simplify system architecture.
• Industrial reliability: Specified for –40 °C to 100 °C operation to meet the needs of temperature-challenging deployments.
• Compact, board-ready package: 484-ball BGA (23 × 23) provides a high-density footprint for space-constrained PCBs.
• Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing and end-product requirements.

Why Choose 10CL016ZF484I8G?

The 10CL016ZF484I8G Cyclone® 10 LP FPGA delivers a balanced combination of logic resources, on-chip memory, and large I/O capability in an industrial-grade package. Its 1.0 V core option and robust operating temperature range make it appropriate for designs that require low-voltage operation and reliable performance across demanding thermal conditions.

Design teams seeking a compact, configurable platform with significant I/O and memory capacity will find this device well suited for embedded control, interface consolidation, and custom processing tasks where integration and temperature tolerance are priorities.

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