10CL016YU484I7G
| Part Description |
Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC 340 516096 15408 484-FBGA |
|---|---|
| Quantity | 1,297 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-UBGA (19x19) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-FBGA | Number of I/O | 340 | Voltage | 1.2 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 963 | Number of Logic Elements/Cells | 15408 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 516096 |
Overview of 10CL016YU484I7G – Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC, 340 I/O, 15,408 Logic Elements, 484-FBGA
The 10CL016YU484I7G is an Intel Cyclone® 10 LP field programmable gate array provided in a 484-FBGA package. It delivers a programmable-logic solution with 15,408 logic elements and 516,096 bits of embedded RAM, suited for industrial-grade deployments that require wide I/O and robust thermal range.
Designed for applications that demand flexible hardware programmability, this device combines a high I/O count and compact surface-mount packaging with a 1.2 V core supply and an industrial operating temperature range of –40 °C to 100 °C.
Key Features
- Logic Capacity — 15,408 logic elements provide programmable fabric for custom logic, state machines, and glue logic implementations.
- Embedded RAM — 516,096 total RAM bits for on-chip buffering, FIFOs, and small memory structures.
- I/O Count — 340 device I/O pins to support extensive peripheral, sensor, and actuator interfacing.
- Power — Standard core voltage of 1.2 V to match Cyclone® 10 LP core requirements.
- Package & Mounting — 484-FBGA package (484-UBGA, 19 × 19) in a surface-mount form factor for compact board integration.
- Industrial Temperature Range — Rated for operation from –40 °C to 100 °C, suitable for industrial environments.
- Compliance — RoHS-compliant device, supporting environmental regulatory requirements.
Typical Applications
- Industrial Control — Programmable logic and broad I/O support allow integration into control systems operating across –40 °C to 100 °C.
- I/O Expansion and Bridging — High pin count enables dense peripheral interfacing and protocol translation in embedded systems.
- Embedded Processing Acceleration — On-chip RAM and programmable logic can be used to offload deterministic data-path functions from processors.
Unique Advantages
- High Logic Density: 15,408 logic elements allow complex designs to be implemented on a single device, reducing board-level component count.
- Substantial On-Chip Memory: 516,096 bits of RAM support local buffering and low-latency data paths without relying on external memory.
- Large I/O Capacity: 340 I/O pins enable a wide range of sensor, actuator, and peripheral connections without I/O multiplexing compromises.
- Industrial-Grade Thermal Range: Rated for –40 °C to 100 °C operation, helping designs meet temperature demands common in industrial deployments.
- Compact Surface-Mount Package: 484-FBGA (19 × 19 UBGA) offers a high-density footprint for space-constrained PCBs while maintaining large I/O availability.
- Regulatory Compliance: RoHS compliance supports environmental and manufacturing requirements for many commercial and industrial products.
Why Choose 10CL016YU484I7G?
The 10CL016YU484I7G positions itself as a practical Cyclone® 10 LP FPGA option when designers need substantial programmable logic, significant on-chip RAM, and a high number of I/O in a compact surface-mount 484-FBGA package. Its 1.2 V core supply and industrial operating temperature range support reliable integration into embedded and industrial platforms.
This device is well suited for engineers building systems that require flexible hardware customization, on-chip memory for low-latency tasks, and extensive interfacing capability while maintaining RoHS compliance and mature device documentation.
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