10CL016ZM164I8G

The 10CL016ZM164I8G is a Cyclone® 10 LP FPGA supplied in a 164‑TFBGA package optimized for surface‑mount assembly. It provides 15,408 logic elements and 516,096 bits of on‑chip RAM, along with 87 general purpose I/O pins, delivering a balanced mid‑range programmable logic resource for embedded and industrial designs.

Specified for industrial operation with a 1.0 V core supply and an operating temperature range of −40 °C to 100 °C, this device is positioned for applications that require moderate logic capacity, substantial internal memory, and reliable operation across a wide temperature span.

Key Features

• Logic Capacity — 15,408 logic elements for implementing custom logic, state machines, and glue‑logic functions.
• Embedded Memory — 516,096 total RAM bits available for FIFOs, buffers, and local data storage.
• I/O Resources — 87 I/O pins to support multiple external interfaces and peripheral connections.
• Core Voltage — 1.0 V core supply (low‑voltage operation) as specified for this device.
• Industrial Temperature Grade — Rated for −40 °C to 100 °C operation to meet industrial environmental requirements.
• Package and Mounting — 164‑TFBGA package; supplier device package listed as 164‑MBGA (8 × 8); surface‑mount mounting type for PCB integration.
• RoHS Compliance — Device is RoHS compliant.

Typical Applications

• Industrial Control and Automation — Implement custom control logic and interface bridging with 15,408 logic elements and robust temperature ratings.
• Embedded System Glue Logic — Use on‑chip RAM and abundant I/O to consolidate discrete logic and peripheral interfacing into a single programmable device.
• Protocol Translation and Interface Aggregation — 87 I/O pins and sizable logic resources make the device suitable for consolidating multiple serial/paralleI interfaces.

Unique Advantages

• Balanced Mid‑Range Logic and Memory: 15,408 logic elements and over half a million RAM bits provide the capacity for substantial processing and buffering without excess cost or footprint.
• Industrial Reliability: Rated for −40 °C to 100 °C operation to support deployments in challenging thermal environments.
• Low‑Voltage Core: 1.0 V core supply reduces core power domain complexity where low‑voltage operation is required.
• Compact BGA Packaging: 164‑TFBGA (164‑MBGA 8 × 8) package enables dense PCB layouts while keeping I/O and resources accessible.
• RoHS Compliant: Meets lead‑free and hazardous‑substance requirements for regulated supply chains.

Why Choose 10CL016ZM164I8G?

The 10CL016ZM164I8G delivers a practical combination of logic density, embedded memory, and I/O count in a compact 164‑TFBGA package with industrial temperature capability. It is suited to engineers seeking a mid‑range FPGA that balances resource availability and system reliability for embedded and industrial designs.

With its 1.0 V core supply, substantial on‑chip RAM, and RoHS compliance, this part offers a straightforward platform for consolidating glue logic, implementing protocol translation, or adding custom control functions while maintaining compatibility with standard surface‑mount assembly flows.

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