10CL016ZE144I8G

The 10CL016ZE144I8G is an Intel Cyclone® 10 LP field programmable gate array (FPGA) in a 144-LQFP exposed pad package. It provides 15,408 logic elements and 516,096 total RAM bits with 78 I/O pins, targeting embedded and industrial FPGA applications that require a compact, surface-mount programmable device.

With a 1.0 V core supply and an industrial operating temperature range of –40 °C to 100 °C, this device is suited for designs that require low-core-voltage operation and extended temperature performance while maintaining a small package footprint (144-EQFP, 20 × 20 mm nominal).

Key Features

• Core Logic 15,408 logic elements deliver substantial programmable logic capacity for mid-range FPGA designs.
• Memory 516,096 total RAM bits for on-chip storage and buffering of data and state machines.
• I/O 78 I/O pins to support multiple peripheral interfaces and board-level connectivity.
• Voltage 1.0 V core supply (listed as 1 V to 1 V) to support the device’s low-voltage core option.
• Package 144-LQFP exposed pad (supplier package: 144-EQFP, 20×20 mm) optimized for surface-mount assembly and thermal conduction through the exposed pad.
• Mounting Surface-mount package suitable for standard PCB assembly flows.
• Temperature Range Industrial-grade operation from –40 °C to 100 °C for deployment in extended-temperature environments.
• Compliance RoHS compliant.

Typical Applications

• Industrial Control Use for digital control logic, protocol bridging, and real-time I/O handling in industrial automation equipment operating over an extended temperature range.
• Embedded Systems Integration as a mid-density programmable fabric for custom processing, peripheral aggregation, and interface adaptation in compact embedded designs.
• Communications Peripherals Implementation of interface logic, simple packet processing, or protocol conversion leveraging available I/O and on-chip RAM.

Unique Advantages

• Balanced logic and memory capacity: 15,408 logic elements combined with 516,096 RAM bits provide a practical balance for mid-size logic functions and on-chip data storage.
• Low-voltage core operation: 1.0 V core supply supports designs targeting lower internal power rails and specific core-voltage system architectures.
• Compact, manufacturable package: 144-LQFP exposed pad (20 × 20 mm) enables surface-mount assembly and improved thermal path to the PCB via the exposed pad.
• Industrial temperature capability: Specified operation from –40 °C to 100 °C for deployment in temperature-challenging environments.
• RoHS compliance: Meets lead-free and restricted-substance requirements for modern manufacturing processes.

Why Choose 10CL016ZE144I8G?

The 10CL016ZE144I8G combines mid-range programmable logic density with substantial on-chip RAM and a practical number of I/Os in a compact 144-LQFP exposed pad package. Its 1.0 V core option and industrial temperature rating make it a fit for embedded and industrial designs that require a low-core-voltage FPGA with reliable operation across an extended temperature window.

This device is well suited to engineers and procurement teams seeking a surface-mount FPGA solution that balances logic capacity, memory, I/O count, and package compactness while maintaining RoHS compliance and industrial temperature performance.

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