10CL016YU484A7G

The 10CL016YU484A7G is an Intel Cyclone® 10 LP field-programmable gate array (FPGA) offered in a 484-ball FBGA package. It implements the Cyclone 10 LP architecture with a 1.2 V core option and on-chip resources sized for moderate-density logic, memory, and I/O integration.

Designed and qualified for automotive use (AEC-Q100), this surface-mount device delivers a combination of logic capacity, embedded RAM, and high I/O count for space-constrained, temperature-challenged designs.

Key Features

• Logic Capacity — 15,408 logic elements and 963 configurable logic blocks (CLBs) provide the programmable fabric for custom logic and state machines.
• Embedded Memory — 516,096 bits of on-chip RAM for buffering, FIFOs, and small data storage functions that reduce external memory dependency.
• I/O Density — 340 I/O pins to support multiple parallel interfaces, sensor arrays, or mixed-signal front-ends.
• Core Voltage — Standard 1.2 V core operating point, aligned with the Cyclone 10 LP "Y" core option for consistent power rail planning.
• Package & Mounting — 484-FBGA package (supplier designation 484-UBGA, 19 × 19) in a surface-mount form factor for compact PCB integration.
• Automotive Qualification — AEC-Q100 qualification and an operating junction range of –40 °C to 125 °C, suitable for automotive-grade temperature environments.
• RoHS Compliant — Conforms to RoHS environmental requirements for lead-free assembly and regulatory compliance.

Typical Applications

• Automotive systems — AEC-Q100 qualification and –40 °C to 125 °C operating range make this device appropriate for automotive ECU functions where programmable logic is required.
• I/O‑dense embedded controllers — 340 I/O pins enable integration of multiple sensors, actuators, and communication links within a single FPGA.
• On‑chip buffering and control — 516,096 bits of RAM support local data buffering, small frame storage, and state-machine implementations without immediate external RAM.
• Compact PCB designs — 484-FBGA surface-mount package (19 × 19 UBGA footprint) supports high-density layouts where board space is limited.

Unique Advantages

• Automotive-capable qualification: AEC-Q100 listing and wide operating temperature range provide deterministic behavior in temperature-stressed environments.
• Balanced resource mix: A combination of 15,408 logic elements and over 500k bits of RAM reduces the need for external devices and simplifies designs.
• High peripheral connectivity: 340 I/O pins let designers consolidate multiple interfaces onto a single device, lowering BOM complexity.
• Compact package: 484-FBGA (484-UBGA, 19 × 19) offers a small footprint for space-constrained electronic modules.
• Environmental compliance: RoHS conformity supports regulatory and manufacturing requirements for lead-free assembly.

Why Choose 10CL016YU484A7G?

The 10CL016YU484A7G positions itself as a mid-density Cyclone 10 LP FPGA option that combines programmable logic, substantial on-chip RAM, and a high I/O count in a compact 484-FBGA package. Its AEC-Q100 qualification and –40 °C to 125 °C operating range make it a practical choice for automotive and other temperature-challenged embedded applications where proven qualification and device-level integration matter.

This part is well suited to designers seeking a single-device programmable solution to consolidate interfaces, implement custom control logic, and buffer data locally while keeping board area and external component count under control.

If you would like pricing, lead-time, or to submit a quote request for 10CL016YU484A7G, please request a quote or contact our sales team with your project requirements. They can provide availability and ordering options tailored to your design schedule.