10CL016YU256I7G
| Part Description |
Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC 162 516096 15408 256-LFBGA |
|---|---|
| Quantity | 302 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-UBGA (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 162 | Voltage | 1.2 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 963 | Number of Logic Elements/Cells | 15408 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 516096 |
Overview of 10CL016YU256I7G – Cyclone® 10 LP FPGA 256-LFBGA
The 10CL016YU256I7G is an Intel Cyclone® 10 LP field-programmable gate array (FPGA) supplied in a 256-LFBGA surface-mount package. It provides a balanced combination of configurable logic, on-chip RAM, and I/O density tailored for industrial embedded designs that require field-programmable logic and flexible interfacing.
Key device attributes include 15,408 logic elements, 516,096 bits of on-chip RAM, 162 I/O, a 1.2 V core supply, and an industrial operating temperature range of –40 °C to 100 °C—delivering deterministic, reconfigurable hardware resources in a compact 14×14 UBGA footprint.
Key Features
- Core & logic: 15,408 logic elements provide the programmable fabric for implementing custom digital logic, state machines, and control functions.
- On-chip memory: 516,096 total RAM bits for buffering, FIFOs, and local data storage without external memory dependencies.
- I/O capacity: 162 available I/O pins to support a wide range of peripheral interfaces and board-level signals.
- Power supply: Specified core supply of 1.2 V, consistent with the device configuration and core-voltage options documented for the Cyclone 10 LP family.
- Package & mounting: 256-LFBGA package; supplier device package listed as 256-UBGA (14×14) for a compact surface-mount footprint.
- Temperature & grade: Industrial grade with an operating temperature range of –40 °C to 100 °C suitable for industrial applications.
- Compliance: RoHS compliant, supporting environmental and regulatory requirements for lead-free assembly.
Typical Applications
- Industrial embedded systems: Implement configurable control logic, deterministic I/O handling, and protocol bridging in industrial automation and instrumentation.
- Interface and protocol conversion: Use the device’s I/O capacity and on-chip RAM for custom bus interfaces, buffering, and bridging between subsystems.
- Prototyping and custom logic acceleration: Rapidly iterate and deploy custom digital functions and application-specific accelerators using the FPGA’s logic resources and RAM.
Unique Advantages
- Integrated logic and memory: 15,408 logic elements coupled with 516,096 bits of RAM reduce the need for external components and simplify board design.
- Substantial I/O density: 162 I/O pins enable multiple peripheral connections and flexible signal routing on compact PCBs.
- Industrial temperature rating: –40 °C to 100 °C operation aligns the device with industrial deployment requirements.
- Compact surface-mount package: 256-LFBGA / 256-UBGA (14×14) delivers a small footprint for space-constrained applications.
- RoHS compliant: Supports lead-free manufacturing and environmental compliance needs.
Why Choose 10CL016YU256I7G?
The 10CL016YU256I7G positions itself as a practical, industrial-grade Cyclone® 10 LP FPGA option when designers need reconfigurable logic, substantial on-chip RAM, and robust I/O in a compact surface-mount package. Its combination of 15,408 logic elements, over half a million bits of RAM, and 162 I/O enables consolidated designs that reduce external components while maintaining flexibility for in-field updates.
This device is well suited to engineering teams designing industrial embedded systems, interface logic, and prototype platforms where predictable operating ranges and industry-grade tolerance are required. The Cyclone 10 LP family documentation and device-level specifications support integration, power planning, and thermal considerations for reliable deployment.
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