10CL016YU484C8G
| Part Description |
Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC 340 516096 15408 484-FBGA |
|---|---|
| Quantity | 793 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-UBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-FBGA | Number of I/O | 340 | Voltage | 1.2 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 963 | Number of Logic Elements/Cells | 15408 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 516096 |
Overview of 10CL016YU484C8G – Cyclone® 10 LP FPGA, 15,408 logic elements, 340 I/O, 484‑FBGA
The Intel Cyclone® 10 LP 10CL016YU484C8G is a commercial‑grade field‑programmable gate array (FPGA) in a 484‑FBGA package. It delivers programmable logic capacity and abundant I/O for commercial embedded designs that require flexible hardware implementation and moderate on‑chip memory.
Key on‑device attributes include 15,408 logic elements, 516,096 bits of total RAM, 340 I/O pins, and a 1.2 V core supply voltage, packaged as a 484‑UBGA (19×19) surface‑mount device with an operating temperature range of 0 °C to 85 °C.
Key Features
- Cyclone 10 LP family: Part of Intel's Cyclone® 10 LP device line, offering FPGA programmability in a commercial‑grade device suitable for a range of embedded applications.
- Logic capacity: 15,408 logic elements to implement custom digital logic, state machines, and glue‑logic functions.
- On‑chip memory: 516,096 total RAM bits for buffers, FIFOs, and small on‑chip storage to support data path and control logic.
- I/O count and flexibility: 340 device I/O pins providing extensive connectivity to external peripherals, sensors, and interfaces.
- Power supply: Standard core supply at 1.2 V as specified for the device.
- Package & mounting: 484‑FBGA (supplier package 484‑UBGA, 19×19) in a surface‑mount form factor for compact PCB integration.
- Commercial temperature grade: Rated for 0 °C to 85 °C operation to meet commercial environmental requirements.
- RoHS compliant: Conforms to RoHS requirements for lead‑free assembly and environmental compliance.
Typical Applications
- Embedded control and logic: Use the 15,408 logic elements to implement custom control, state machines, and timing logic for commercial embedded systems.
- Interface bridging and I/O expansion: Leverage 340 I/O pins to connect multiple peripherals, translate between interfaces, or aggregate signals on a compact PCB.
- On‑board buffering and small data paths: Use the 516,096 bits of RAM for temporary storage, FIFOs, and buffering in data‑flow or control paths.
Unique Advantages
- Balanced logic and memory capacity: 15,408 logic elements paired with over half a million RAM bits enables practical implementations of moderate‑complexity designs without external memory for many use cases.
- High I/O density: 340 I/O pins provide extensive connectivity options, reducing the need for external I/O expanders in multi‑device systems.
- Compact surface‑mount package: 484‑FBGA (484‑UBGA, 19×19) allows high‑density placement on modern PCBs while supporting a large pin count.
- Commercial operating range: Rated for 0 °C to 85 °C, matching typical commercial product environmental windows.
- Regulatory readiness: RoHS compliance supports lead‑free manufacturing processes and environmental regulations.
Why Choose 10CL016YU484C8G?
The 10CL016YU484C8G provides a practical combination of programmable logic, on‑chip RAM, and plentiful I/O in a compact surface‑mount package for commercial embedded systems. Its 1.2 V core supply and Cyclone® 10 LP platform characteristics make it suitable for designs that need moderate logic density and flexible interfacing without moving to larger, more power‑hungry device classes.
This part is well suited to engineering teams and procurement looking for a RoHS‑compliant, commercially rated FPGA offering a balance of logic resources, memory, and I/O density for system‑level integration and hardware customization.
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