10CL025YE144C8G

IC FPGA 76 I/O 144EQFP
Part Description

Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC 76 608256 24624 144-LQFP Exposed Pad

Quantity 899 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package144-EQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFP Exposed PadNumber of I/O76Voltage1.2 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1539Number of Logic Elements/Cells24624
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits608256

Overview of 10CL025YE144C8G – Cyclone® 10 LP FPGA, 24,624 Logic Elements, 144-LQFP

The 10CL025YE144C8G is an Intel Cyclone® 10 LP Field Programmable Gate Array (FPGA) supplied in a 144-LQFP exposed‑pad package. It provides 24,624 logic elements, 608,256 bits of on‑chip RAM, and 76 user I/Os in a surface‑mount footprint designed for commercial‑grade applications.

This device is suitable for designs that require mid‑range programmable logic capacity with integrated memory and a compact package, operating from a 1.2 V core supply and over a commercial temperature range of 0 °C to 85 °C.

Key Features

  • Logic Capacity — 24,624 logic elements to implement combinational and sequential logic for mid‑range FPGA designs.
  • On‑chip Memory — 608,256 total RAM bits for data buffering, FIFOs, and small on‑chip storage needs without external memory.
  • I/O Count — 76 user I/Os providing flexible interfacing options for peripherals and board signals.
  • Package and Mounting — 144‑LQFP with exposed pad (supplier package: 144‑EQFP, 20 × 20) in a surface‑mount form factor for compact board integration.
  • Power — Standard core supply at 1.2 V per device specification.
  • Commercial Grade and Temperature — Rated for commercial operation with an ambient temperature range of 0 °C to 85 °C.
  • Environmental Compliance — RoHS compliant.

Typical Applications

  • Embedded Logic and Control — Implement control and glue logic where 24,624 logic elements and on‑chip RAM provide integrated programmability.
  • I/O‑Centric Interfaces — Drive board‑level interfaces and signal conditioning using the 76 available I/Os for peripheral and sensor connectivity.
  • Data Buffering and Packet Processing — Use the 608,256 bits of RAM for buffering, small packet queues, and temporary data storage in real‑time applications.

Unique Advantages

  • Balanced Logic and Memory: Combines 24,624 logic elements with 608,256 bits of RAM for designs that need both programmable logic and on‑chip storage.
  • Compact Surface‑Mount Package: 144‑LQFP exposed‑pad packaging enables higher‑density PCB layouts while providing thermal pad mounting.
  • Flexible I/O Count: 76 user I/Os reduce dependence on external interface chips for many board‑level designs.
  • Commercial Temperature Range: Rated for 0 °C to 85 °C operation, matching typical commercial product requirements.
  • Regulatory Readiness: RoHS compliance supports environmental and manufacturing requirements.

Why Choose 10CL025YE144C8G?

The 10CL025YE144C8G provides a well‑balanced combination of logic density, embedded RAM, and I/O capability in a compact 144‑LQFP surface‑mount package. Its 1.2 V core and commercial temperature rating make it appropriate for mid‑range commercial applications that need onboard programmable logic and memory without a large package footprint.

As part of the Intel Cyclone® 10 LP family, the device is specified with clear electrical and operating parameters, enabling predictable integration into commercial embedded systems where mid‑level logic capacity and on‑chip RAM are key design drivers.

Request a quote or submit an inquiry to receive pricing and availability for the 10CL025YE144C8G. Our team can provide procurement details and support for your project timeline.

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