10CL025YU256A7G
| Part Description |
Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC 150 608256 24624 256-LFBGA |
|---|---|
| Quantity | 1,000 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-UBGA (14x14) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 150 | Voltage | 1.2 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1539 | Number of Logic Elements/Cells | 24624 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 608256 |
Overview of 10CL025YU256A7G – Cyclone® 10 LP FPGA, 256‑LFBGA, Automotive (AEC‑Q100)
The 10CL025YU256A7G is an Intel Cyclone® 10 LP field programmable gate array (FPGA) provided in a 256‑LFBGA package. It delivers a balance of programmable logic, on‑chip memory and flexible I/O in a compact surface‑mount package targeted at designs that require automotive qualification and extended temperature operation.
Key on‑device resources include 24,624 logic elements, 608,256 bits of on‑chip RAM and 150 I/O pins, with a nominal core supply of 1.2 V and an operating temperature range from –40 °C to 125 °C.
Key Features
- Programmable Logic Capacity — Provides 24,624 logic elements to implement custom digital functions and control logic.
- On‑chip RAM — 608,256 bits of embedded memory for buffering, FIFOs and local data storage.
- I/O Density — 150 I/O pins enable multiple external interfaces and peripherals from a single device.
- Automotive Qualification — Grade: Automotive with AEC‑Q100 qualification for applications requiring automotive‑grade component qualification.
- Robust Operating Range — Rated for operation from –40 °C to 125 °C to support harsh thermal environments.
- Low‑voltage Core — Core supply specified at 1.2 V, consistent with low‑voltage FPGA operation.
- Compact Surface‑Mount Package — 256‑LFBGA (vendor package 256‑UBGA, 14 × 14 mm) for space‑constrained PCB designs.
- RoHS Compliant — Conforms to RoHS environmental requirements.
Typical Applications
- Automotive control modules — Suitable where automotive qualification and wide operating temperature are required for vehicle electronics and subsystem control.
- Embedded signal processing — On‑chip logic and 608,256 bits of RAM support custom data paths, filtering and protocol processing.
- Custom interface aggregation — 150 I/O pins provide the flexibility to implement multiple sensor, actuator and communication interfaces in a single device.
Unique Advantages
- Automotive‑grade qualification: AEC‑Q100 qualification and –40 °C to 125 °C operating range support deployment in automotive environments.
- Significant logic density: 24,624 logic elements let designers implement complex control and processing functions without external logic.
- Substantial on‑chip memory: 608,256 bits of RAM reduce dependence on external memory for many buffering and data‑handling tasks.
- Flexible I/O in a compact package: 150 I/O pins in a 256‑LFBGA (14 × 14 mm) surface‑mount package help minimize board area while supporting diverse interfaces.
- Low core voltage: 1.2 V core supply supports low‑power system architectures and standard Cyclone 10 LP power domains.
- Regulatory compliance: RoHS compliance supports environmental and manufacturing requirements.
Why Choose 10CL025YU256A7G?
The 10CL025YU256A7G combines a substantial logic element count, significant on‑chip RAM and ample I/O in a compact, surface‑mount 256‑LFBGA package, packaged and qualified for automotive use with AEC‑Q100. Its 1.2 V core supply and wide operating temperature range make it well suited to embedded designs that require robust operation and integration in constrained PCB footprints.
This device is appropriate for teams building automotive control systems, embedded processing modules and custom interface aggregators that need verifiable, automotive‑qualified FPGA resources in a single component.
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