10CL025ZE144I8G

The 10CL025ZE144I8G is an Intel Cyclone® 10 LP FPGA in a 144-LQFP exposed-pad package, offered as an industrial-grade programmable logic device. It delivers a balance of on-chip logic, embedded RAM, and I/O count suitable for industrial designs that require reconfigurable logic and board-level integration.

Configured with a 1.0 V core option and rated for surface-mount assembly, this device targets applications that need measurable logic capacity, substantial on-chip RAM, and robust operating temperature capability.

Key Features

• Logic Capacity — 24,624 logic elements and 1,539 CLBs listed in the product data provide a substantial resource pool for custom logic, control, and glue-logic implementations.
• On-chip Memory — 608,256 total RAM bits for embedded buffering, state storage, and small local data structures without external memory.
• I/O Resources — 76 user I/O pins to interface with sensors, actuators, peripherals, and board-level connectors.
• Core Voltage — 1.0 V core supply (lower core voltage option indicated), matching the part’s Z designation in the product identifier.
• Package and Mounting — 144-LQFP exposed pad (supplier package listed as 144-EQFP 20×20) in a surface-mount footprint for compact PCB integration and thermal conduction through the exposed pad.
• Industrial Temperature Range — Rated to operate from −40 °C to 100 °C, suitable for deployed industrial environments.
• Compliance — RoHS compliant, supporting lead-free assembly and environmental requirements.

Typical Applications

• Industrial Control and Automation — Leverage the industrial temperature rating and 76 I/O for sensor interfacing, motor control logic, and real-time control tasks.
• Embedded Logic and Glue Functions — Use 24,624 logic elements and on-chip RAM to implement protocol bridging, timing-critical glue logic, and custom finite-state machines.
• Prototype and Development Platforms — The exposed-pad 144-LQFP package and surface-mount mounting enable rapid evaluation and integration into development boards and target hardware.

Unique Advantages

• Measured Logic Density: 24,624 logic elements and 1,539 CLBs provide a clearly defined resource envelope for planning logic partitioning and feature allocation.
• Integrated On-Chip Memory: 608,256 bits of RAM reduce reliance on external memory for buffering and small data structures, simplifying board design.
• Board-Level Integration: 144-LQFP exposed-pad package with surface-mount mounting supports compact PCB layouts and enhanced thermal conduction through the exposed pad.
• Industrial-Rated Operation: −40 °C to 100 °C operating range aligns the device with many industrial deployment environments.
• Regulatory Compatibility: RoHS compliance supports lead-free manufacturing processes and environmental requirements.

Why Choose 10CL025ZE144I8G?

The 10CL025ZE144I8G combines Intel Cyclone® 10 LP architecture with a clear, application-oriented feature set: substantial logic element count, significant on-chip RAM, a practical I/O complement, and an industrial operating range. These attributes make it well suited for engineers designing compact, reprogrammable solutions that need reliable logic resources and board-level integration.

This part is appropriate for projects that require predictable resource budgeting (logic elements, RAM, and I/O) and a surface-mount, exposed-pad package for thermal performance. As an industrial-grade Cyclone® 10 LP offering from Intel, it provides a defined platform for scalable, reconfigurable designs.

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